Micron Technology, Inc. today introduced the industry's smallest 128-gigabit (Gb) NAND flash memory device utilizing its award-winning 20-nanometer (nm) process technology. The new 128Gb device stores three bits of information per cell, called triple-level-cell (TLC), creating a highly compact storage solution.
Measuring 146mm2, the new 128Gb TLC device is more than 25 percent smaller than the same capacity of Micron's 20nm multi-level-cell (MLC) NAND device. The 128Gb TLC device is targeted at the cost-competitive removable storage market (flash cards and USB drives), which is projected to consume 35 percent of total NAND gigabytes in calendar 2013.1 Micron is now sampling the 128Gb TLC NAND device with select customers; it will be in production in calendar Q2.
"This is the industry's smallest, highest-capacity NAND flash memory device—empowering a new class of consumer storage applications," said Glen Hawk, vice president of Micron's NAND Solutions Group. "Every day we learn of new and innovative use cases for flash storage, underpinning the excitement and opportunity for Micron. We are committed to enriching our portfolio of leading Flash storage solutions that serve our broad customer base."
Intel Corporation today announced its Intel Cache Acceleration Software (CAS) for Linux that prioritizes application performance, providing solid-state drive (SSD) levels of speed without migration costs, and built-in data integrity for Intel's SSD data center family of products.
The Linux version of the software will be generally available within 30 days as an enterprise subscription and open source release. It will complement the existing Intel CAS 2.0 for Windows that is available today.
Intel CAS 2.0 is based on technology from Intel's August 2012 acquisition of NEVEX Virtual Technologies, and provides key capabilities that enhance the company's SSD data center family of products. Intel's CAS 2.0 solution provides significant input/output (I/O) and application performance improvements in use cases including database/OLTP, virtualization, cloud and big data (Hadoop).
"Intel CAS complements our SSD data center family by providing a total caching solution that delivers even more value and capability for our customers," said Chuck Brown, product line manager for Intel's Non-Volatile Memory Solutions Group. "Intel CAS delivers a multi-level cache across the SSD and DRAM for optimal performance. Compared to short-stroked hard-drive technology, we've seen up to 50 times the improvement in I/O performance throughput for read intensive workloads by adding Intel CAS with the Intel SSD 910 series."
Transcend Information, Inc. (Transcend ), a leading manufacturer in industrial-grade products, today announced the addition of the MSA740 and MSA630 mSATA, and the HSD630 half-slim SATA solid state drives (SSD) to its industrial product line. The new small form factor SSDs offer Transcend's industry-proven SSD durability, power savings and reliability, while at the same time delivering new levels of performance to mobile computing devices such as notebooks, tablet PCs, and other embedded storage applications.
Transcend's MSA740 mSATA SSD combines the next-generation SATA III 6Gb/s interface, DDR3 DRAM cache, and a powerful controller to attain sequential read and write speeds of up to 520 and 270 MB/s respectively, in addition to 4k random read/write speeds of up to 70,000 IOPS. This incredible performance helps significantly improve boot up and data transfer times, application launch speed, and overall system responsiveness. Despite measuring just 29.85 x 50.8 x 4 mm, the MSA740 comes equipped with advanced features including S.M.A.R.T., TRIM and NCQ support, dynamic power management, built-in ECC and wear leveling, intelligent block management, and excellent shock resistance, providing exceptional reliability and data protection.
Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, announces its USB 3.0 Express RC4 has been certified for usage with Windows To Go, a new feature of Microsoft’s Windows 8 Enterprise edition. The RC4 is SuperTalent’s second drive to be certified to date. Windows To Go enables enterprises to provision a full corporate image on an external USB drive which users can boot and operate from almost any PC. SuperTalent plans to continue to work with firms to unveil its “hardware secure” version in the near future.
Certified through the Windows 8 Hardware certification kit, Super Talent’s RC4 is one of the world’s top USB 3.0 drives with SSD technology; it provides high random read/write speed capabilities and reports itself as fixed media. Super Talent’s RC4 meets and surpasses many of the performance requirements of Windows To Go certified drives.
Toshiba Corporation and Toshiba America Electronic Components, Inc., (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today announced that it began shipping samples of its 64-gigabyte (GB) embedded NAND flash memory module equipped with a Universal Flash Storage (UFS) interface. The first in the industry, the new module is fully compliant with the JEDEC UFS Ver.1.1 standard, and is designed for a wide range of digital consumer products - including smartphones and tablet PCs.
With improved data processing speeds in host chipsets and wider bandwidths for wireless connectivity, demand continues to grow for large density, high-performance memory that supports high resolution video. A proven innovator in this key area, Toshiba is reinforcing its leadership role by being the first in the industry to ship samples with a 64GB UFS module.
Samples are mainly intended for evaluation of the UFS interface and its protocol in host chipsets and by OS vendors. Toshiba will schedule mass production of the 64GB UFS module, as well as other densities in its lineup, according to market demand.