In order to meet the evolving needs of Netcom data center computing, global memory provider TEAMGROUP is proud to introduce the new DDR5 VLP ECC U-DIMM normal and wide temperature (-40° to +85°C) memory module. It features DDR5 high performance, high frequencies, and large-capacity industrial ICs. Designed to have an extremely low profile for greater performance and more compact hardware configurations, the U-DIMM provides users with better performance and reliability than ever before.
TEAMGROUP's DDR5 VLP ECC U-DIMM memory modules come in frequencies up to 4800 MHz and 5600 MHz to ensure fast data processing and enhance computing performance. The memory is also offered in a wide range of capacity options, from 16GB to 48GB, allowing users to select the most suitable capacity kit for their platform's workload and computing needs. This module comes in an ultra-low-profile design, with a board height of only 0.738 inches, half of the normal modules. This allows it to meet the hardware configuration requirements of blade servers and helps maximize space for the user’s configuration of components, and achieves higher server density.Add a comment
Global memory brand TEAMGROUP announced the launch of its updated ELITE memory modules with enhanced frequencies today: the ELITE PLUS DDR5 and ELITE DDR5 Desktop Memory 6400MHz (1.1V CL52-52-52-103). Both comply with JEDEC memory standards and fulfill the needs of demanding applications and high-performance computing.
In response to the growing demand for high-speed computing and digital technology, TEAMGROUP has introduced the upgraded ELITE PLUS DDR5 6400MHz and ELITE DDR5 6400MHz memory modules, which boast higher frequencies and low power consumption. The updated specs of the ELITE memory fully meet the needs of learning, entertainment, and more on desktop computers. With the modules’ low operating voltage of 1.1V, power consumption is significantly reduced, and the computer’s lifespan is extended. In addition, DDR5's Same-Bank Refresh feature and optimized IC structure can process the double amount of data simultaneously compared to DDR4, which enables computers to operate more smoothly while multi-tasking and significantly improves operating efficiency.Add a comment
The leading memory brand TEAMGROUP has upgraded the capacities of its industrial DDR5 series memory products, by leveraging its outstanding R&D and product design capabilities, taking the lead in launching a 48GB module, as well as a lower 24GB option. The capacity upgrades apply to all types of DDR5 products, including the DDR5 non-ECC U/SO-DIMM, DDR5 ECC U/SO-DIMM class, and DDR5 ECC R-DIMM memory modules. They provide higher capacity for applications using high-performance edge computing, embedded computers, personal workstations, and more.
Current industrial DDR5 memory on the market has a maximum capacity of about 32GB per module. However, with the development of technologies such as cloud, edge computing, the Internet of Things, and big data, the demand for memory capacity is increasing. Edge computing systems need to process large amounts of data from a variety of sensors and devices and perform complex calculations and analyses that require high memory capacity and performance. To meet this demand, TEAMGROUP has made capacity upgrades across its industrial DDR5 memory products, offering new 24GB and 48GB modules. They bring more application flexibility and enable users to better handle large data sets, complex simulations, and analysis tasks. The enhanced capacities will significantly increase the performance and processing power of edge computing systems, providing users with the ability to run various applications and algorithms more efficiently.Add a comment
XPG, the e-sports arm of ADATA, the world's leading memory brand, specializes in creating high-performance and stunningly designed e-sports products for e-sports enthusiasts, technology-minded gamers, and overclockers. XPG today announced the launch of LANCER BLADE RGB DDR5 and LANCER BLADE DDR5 memory, emphasizing its low-profile heatsink design, freeing motherboard assembly from heatsink height, and providing a profile that is perfect for small cases with limited space. The XPG LANCER BLADE series includes two models with top speeds of 6000MT/s and 6400MT/s.
By utilizing high-quality carefully selected Hynix chips, these memory modules are low latency and easy to overclock while allowing gamers to enable a hassle-free speed boost with one-click overclocking. At the same time, The XPG LANCER BLADE series supports Intel XMP 3.0 and AMD EXPO and is compatible with the latest Intel and AMD platforms, ensuring excellent memory stability and a smoother operating experience when multitasking or running large-scale applications. In addition, the XPG LANCER BLADE series adopts a high price-performance strategy, combined with excellent operation and quality, it is definitely the foremost choice when gamers upgrade their systems.Add a comment
Leading storage product brand, TEAMGROUP, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0–70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40–85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, TEAMGROUP has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.
TEAMGROUP's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.Add a comment
Micron Technology, Inc.,today announced volume production availability of high-capacity 96GB DDR5 RDIMMs in speeds up to 4800MT/s, which have double the bandwidth compared to DDR4 memory. By unlocking the next level of monolithic technology, the integration of Micron’s high-density memory solutions empowers artificial intelligence (AI) and in-memory database workloads and eliminates the need for costly die stacking that also adds latency. Micron’s 96GB DDR5 RDIMM modules are qualified with 4th Gen AMD EPYC™ processors. Additionally, the Supermicro 8125GS — an AMD-based system — includes the Micron 96GB DDR5 modules and is an excellent platform for high-performance computing, artificial intelligence and deep learning training, and industrial server workloads.
“Delivering high-capacity memory solutions that enable the right performance for compute-intensive workloads is essential to Micron’s role as a leading memory innovator and manufacturer. Micron’s 96GB DDR5 DRAM module establishes a new optimized total cost of ownership solution for our customers,” stated Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group. “Our collaboration with a flexible system provider like Supermicro leverages each of our strengths to provide customers with the latest memory technology to address their most challenging data center needs.”Add a comment
Golden Emperor International Ltd. – one of the world's leading PC components & peripheral manufacturers today announced the latest Pristine R5 series as well as Spear R5 series server memory products, providing solutions not only for the needs of standard Registered DIMMs which fully complies with the JEDEC specifications but also the market of high-end applications which requires high-performance server memory.
GeIL stated that the popularity of online games and the metaverse brings not simply the growth momentum of the server market, related requirements such as the gaming service, the big data analysis, and AI applications also create the massive needs of cloud computing which customers are now asking for great performance rather than just focusing on stability, reliability and security when it comes to the server products. GeIL further pointed out that the demand for high-bandwidth and large-capacity server memory is therefore continuously and rapidly growing.Add a comment
Samsung Electronics, a world leader in advanced memory technology, today announced that its 16-gigabit (Gb) DDR5 DRAM, which utilizes the industry’s most advanced 12 nanometer (nm)-class process technology, has started mass production. Samsung’s completion of the state-of-the-art manufacturing process reaffirms its leadership in cutting-edge DRAM technology.
“Using differentiated process technology, Samsung's industry-leading 12nm-class DDR5 DRAM delivers outstanding performance and power efficiency,” said Jooyoung Lee, Executive Vice President of DRAM Product & Technology at Samsung Electronics. “Our latest DRAM reflects our continued commitment to leading the DRAM market, not only with high-performance and high-capacity products that meet computing market demand for large-scale processing, but also by commercializing next-generation solutions that support greater productivity."Add a comment
Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, proudly introduces the CVN ICICLE DDR5 high-performance memory for enthusiasts and overclockers. With a high-speed configuration of DDR5-6600MHz frequency, this memory is built for speed.
The CVN ICICLE DDR5 memory supports Intel® XMP 3.0 technology that allows users to boost performance with ease via the BIOS by activating the predefined and tested Intel XMP profile. Furthermore, its advanced heatsink design provides excellent heat dissipation to achieve higher overclocks.Add a comment
Lexar, a leading global brand of flash memory solutions, is excited to announce Lexar ARES RGB DDR5 Desktop Memory. Specifically designed for gaming, this next-gen DDR5 memory delivers superior performance with speeds starting at 5600MHz and up to 6000MHz, and with quick CL32-36-36-68 / CL34-38-38-76 timings (XMP 3.0 & EXPO). A premium aluminum heat spreader keeps the gaming system cool for ultra-fast performance.
Lexar ARES RGB DDR5 Desktop Memory features on-board Power Management IC (PMIC) to provide better power control and power delivery and it also includes Lexar RGB Sync which lets gamers customize the RGB LED to their own style.Add a comment