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Plextor, leading developer and manufacturer of high-performance digital storage devices, is slated to give a sneak preview of their new M6 SSD at the Flash Memory Summit and Exhibition to be held August 13-15 at the Santa Clara Convention Center in Santa Clara, CA.
The M6 features the next generation of Plextor’s proprietary TrueSpeed technology that works in tandem with the Marvell 88SS9187 controller for enhanced performance and reliability. The new drive will also feature the latest generation of A19 Toggle NAND flash from Toshiba and an ultra-slim 5mm casing. Additional product specifications and a formal release date are expected to be announced in the coming months.
In addition to the M6, Plextor will be displaying its complete lineup of storage solutions. Included are Plextor’s flagship M5 Pro Extreme and M5S series, the critically acclaimed M5M mSATA drive, and their much-anticipated M.2 form-factor drive. The M.2 (formerly New Generation Form Factor or NGFF) is the new industry standard form factor and is slated to replace drives such as the mPCIe, mSATA, and other versions of the blade SSD.
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Virtium, a leading provider of storage and memory solutions for industrial embedded systems, today introduced its DecaStor line of solid state drives (SSDs). Designed to help embedded systems OEMs rely on a ready supply of SSDs in hard-to-find capacities, Virtium DecaStor 2.5 and 1.8-inch SSDs are ideal storage solutions for applications designed around 80, 160 and 300 gigabyte (GB) capacity points. DecaStor SSDs also feature 10-channel controllers, which deliver compatible transfer speeds for a wide range of networking, industrial, in-flight entertainment, PoS terminals, gaming equipment and mobile monitoring systems.
“Most of our OEM customers design their applications around specific capacity points,” said Gary Drossel, vice president of product strategy at Virtium. “Migrating to different capacities is not as easy as it is in the client space and often creates the need for software changes that must be re-qualified. Virtium saves industrial embedded OEMs from this software effort with drop-in 1.8 and 2.5-inch SSD replacements previously offered by suppliers that are now opting to pursue the data center and client markets.”
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Kingston Technology Europe Co LLP, an affiliate of Kingston Technology Company Inc., the independent world leader in memory products, today announced a series of Na`Vi branded products , developed in collaboration with the world’s multiple champion eSports club Natus Vincere.
The long and productive partnership of Kingston and Na`Vi has helped to create a series of bright & stylish branded products. Having won seven world championships and more than 2.5 million dollars in prize money, unlike anyone else, the professional players of Natus Vincere team, know which technical resources are necessary in order to become a champion.
The Na`Vi branded limited edition products are primarily aimed at gamers and enthusiasts, who require high performance and reliability, as well as all fans of Na`Vi and eSports, who want to own this unique product to show their support. The Na`Vi Limited Edition collection includes the SSD drives based on the high performance, award winning HyperX 3K model, available with a capacity of 120 GB or 240 GB, as well as top quality HyperX Genesis memory module kits.
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Memory and storage specialist Integral has launched the Fusion USB 3.0 Flash Drive. Measuring a tiny 21x12x4.5mm and weighing only 3g, Fusion 3.0 is one of the smallest flash drives in the world.
The Fusion 3.0 Drive meets the demand for high-speed, high-capacity storage, in a compact and stylish flash drive. The low profile and non-protruding design makes the Fusion 3.0 ideal for “leave-in” multimedia environments such as Smart TVs, home and car audio, game consoles, laptops and tablets. The drive has been designed to fit easily and safely onto a key ring.
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Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first three-dimensional (3D) Vertical NAND (V-NAND) flash memory, which breaks through the current scaling limit for existing NAND flash technology. Achieving gains in performance and area ratio, the new 3D V-NAND will be used for a wide range of consumer electronics and enterprise applications, including embedded NAND storage and solid state drives (SSDs).
Samsung’s new V-NAND offers a 128 gigabit (Gb) density in a single chip, utilizing the company’s proprietary vertical cell structure based on 3D Charge Trap Flash (CTF) technology and vertical interconnect process technology to link the 3D cell array. By applying both of these technologies, Samsung’s 3D V-NAND is able to provide over twice the scaling of 20nm-class* planar NAND flash.
