ADATA Technology, a leading manufacturer of high performance DRAM modules, NAND Flash products, and mobile accessories today launched the XPG SX950 SSD and its accompanying gaming-styled EX500 drive enclosure. Loaded with up to 960GB of 3D MLC NAND and driven by a SMI controller, the SX950 utilizes a custom ADATA PCB and is backed by an extra-strict chip sorting process to ensure an SSD that can handle prolonged high demand. Performance reaches 560MB/s read and 530MB/s write. Bearing the signature XPG look, the EX500 is aimed at gamers and case modders, boasting a textured enclosure and a vibrant yet aggressive feel. It arrives with a spacer and bracket for easy install on desktops and notebooks. For users that would like to use the SX950 as external storage, the EX500 offers a stylish, durable, and easy-install enclosure that pairs instantly with desktops, notebook! s, and game consoles via high speed USB 3.1.
ADATA is completing its transition to stacked memory, or 3D NAND. This allows for SSDs with bigger capacities without a correlating increase in prices paid by end users. The SX950 uses durable 3D MLC (multi-level cell) NAND Flash and SMI controller. Consumers can choose from 240GB, 480B, and 960GB versions of the SX950. Not only denser (higher capacity), 3D NAND is also roughly 10% faster than 2D NAND and so the SX950 outpaces its predecessor, the SX930 – reaching 560MB/s read and 530MB/s write.Add a comment
Toshiba Corporation today announced that it has started construction of a new state-of-the-art semiconductor fabrication facility, Fab 6, and a new R&D center, the Memory R&D Center, at Yokkaichi Operations in Mie prefecture, Japan, the company’s main memory production base.
Fab 6 will be dedicated to production of BiCS FLASH™, Toshiba’s innovative 3D Flash memory. Like Fab 5, construction will take place in two phases, allowing the pace of investment to be optimized against market trends, with completion of Phase 1 scheduled for summer 2018. Toshiba will determine installed capacity and output targets and schedules by closely monitoring the market.
Toshiba will also construct a Memory R&D Center adjacent to the new fab, with completion targeting December 2017. The facility will advance development of BiCS FLASH™ and new memories.Add a comment
Western Digital Corp. today announced that it has commenced pilot production of the company's 512 Gigabit (Gb) three-bits-per-cell (X3) 64-layer 3D NAND (BICS3) chip in Yokkaichi, Japan, with mass production expected in the second half of 2017. The first of its kind, the chip is the latest achievement in a nearly three-decades-long legacy of flash memory industry firsts from the storage leader.
"The launch of the industry's first 512Gb 64-layer 3D NAND chip is another important stride forward in the advancement of our 3D NAND technology, doubling the density from when we introduced the world's first 64-layer architecture in July 2016," said Dr. Siva Sivaram, executive vice president, memory technology, Western Digital. "This is a great addition to our rapidly broadening 3D NAND technology portfolio. It positions us well to continue addressing the increasing demand for storage due to rapid data growth across a wide range of customer retail, mobile and data center applications."
The 512Gb 64-layer chip was developed jointly with the company's technology and manufacturing partner Toshiba. Western Digital first introduced initial capacities of the world's first 64-layer 3D NAND technology in July 2016 and the world's first 48-layer 3D NAND technology in 2015; product shipments with both technologies continue to retail and OEM customers.Add a comment
Freecom announces the launch in Europe of the mSSD MAXX – a super-fast, compact and stylish SSD for Mac and PC users. The introduction of the high-performing and lightweight SSD completes the line-up for the wider Freecom family of HDD and SSD products which all boast a strong aluminium enclosure with a sleek brushed metal textured appearance.
Available in 512GB, the mSSD MAXX delivers data transfer speeds of up to 700MB/s, making it one of the fastest portable SSDs available in the market.
The storage device weighs just 72g and measures 91mm x 57mm and 10mm (L x W x H) to strike a very appealing balance between pocket-friendly portability and accelerated performance that allows users to dramatically reduce data read and write waiting times.Add a comment
Transcend Information, Inc. (Transcend), a leading manufacturer of industrial-grade products, proudly presents the industrial-grade SuperMLC JetFlash 740 USB flash drive. Positioned between its SLC and MLC NAND flash offerings, Transcend’s exclusive SuperMLC technology is a cost-effective solution that offers performance close to that of SLC NAND flash. Compliant with USB 3.1 Gen 1 specifications, the JetFlash 740 boasts excellent performance and endurance at affordable prices, making it ideal for demanding industrial grade applications.
Blazing-Fast Performance up to 120MB/s
Drawing on the strengths of both Single-Level Cell (SLC) and Multi-Level Cell (MLC) NAND flash, Transcend has developed SuperMLC technology by reprogramming the two bits per cell of MLC into one bit per cell, greatly boosting performance. Compliant with USB 3.1 Gen 1 specifications, the transfer speeds of Transcend’s JetFlash 740 USB flash drive can reach up to 120MB/s read and 90MB/s write, double those of MLC flash chips. Transcend’s SuperMLC technology is a great match for industrial applications that demand quality comparable to SLC NAND flash at a cost-effective price.
Phison Electronics, a worldwide industry leader in flash controller and NAND solutions, kicks off the new year with its showcase at the Consumer Electronics Show (CES) 2017, displaying its latest and greatest technologies for SSD, USB, SD, and UFS solutions. Invited attendees can find Phison at Las Vegas’ Caesar’s Palace in a demo suite exhibiting the company’s industry-leading product portfolio.
Phison will be unveiling at CES 2017 a new PCIe Gen 3x2 NVMe controller, the PS5008. This controller provides incredible performance, nearly three times that of SATA, but delivered at a competitive price point, highlighting Phison’s endeavor to bring PCIe SSDs into mainstream adoption.
For enterprise applications, Phison has partnered with Liqid Inc. to enable the world’s fastest U.2 SSD, utilizing the ultra-high speed PCIe Gen3x4 PS5007-E7, Phison’s powerful 8-channel NVMe controller. Additionally, Phison is driving forward as a market leader to address the explosive demands of cloud storage with its SATA S10DC enterprise solution (announced at Flash Memory Sumit 2016). Two other top-performing SATA controllers, the PS3110-S10 and PS3111-S11T, are also on display.Add a comment
Western Digital Corporation, a global storage technology and solutions leader, today announced its fastest, high-capacity USB flash drive to date with the launch of its high-performance 256GB SanDisk Extreme PRO USB 3.1 Solid State Flash Drive. The new drive delivers the speed, capacity, and reliability of an SSD in the convenient form factor of a small USB flash drive, and is ideal for creative professionals, tech enthusiasts, or anyone who creates and shares massive files.
A game-changer in the USB storage category, the drive is capable of read speeds up to 420MB/s and write speeds up to 380MB/s1. With its unprecedented speeds, you can transfer full-length 4K movie to the drive in less than 15 seconds2. With its USB 3.1 interface, people can rapidly access and move files on the go, without having to worry about a cable. The new drive also features a sophisticated design with a durable aluminum metal casing and a retractable connector for ultimate style and reliability.Add a comment
Western Digital Corporation (“Western Digital”) today announced the availability of new WD Black PCIe solid state drives (SSDs), the first WD-branded client PCIe SSDs. The new SSDs complement the recently announced WD Blue and WD Green SATA SSDs, as well as the company’s industry leading family of hard drives for PCs and workstations, providing a full portfolio of WD storage devices for virtually any application.
The WD Black PCIe SSD is a performance PCIe Gen3 x4 NVMe-based SSD that delivers more than three times the sequential read speeds of current SATA SSDs. The 256GB and 512GB capacities make it ideal as a boot drive when paired with a high-capacity hard drive, or as primary storage when building a future-ready PC. Consumers who are using the new WD Black PCIe SSD to boot up, load read-intensive games or applications, or shut down a system may realize a performance improvement of more than 10 seconds when compared to SATA SSDs.Add a comment
Patriot, a global leader in performance memory, SSDs, gaming peripherals and flash storage solutions, today announced the release of two new Type-C USB drives. The Stellar-C Vertical (STC-Vi) and the Stellar-C Pass-Through (STC-Ti) will provide users with high capacity, portable storage solutions for the ever growing Type-C technology.
The Patriot STC-Vi will provide users with an upright solution to minimize obstruction while in use with Type-C smartphones or tablets and provides a low-profile, plug-and-stay, drive for use in notebooks, such as the MacBook®, and desktop PCs. “With the STC-Vi, the new vertically positioned Type-C flash drive, we are giving the consumer something that will mesh well with Type-C mobile devices both in style and portability,” said Meng J. Choo, Patriot’s Flash Product Manager. Available in a range of capacities from 64GB to 128GB, the STC-Vi will have a transfer rate of up to 225MB/s read and up to 25MB/s write for a seamless transfer between devices.Add a comment
Lite-On Storage, a rising player in the rapidly expanding solid-state drive (SSD) industry, said today it will release SSDs later this year with 3D NAND flash technology.
The company will showcase its latest drives during an invitation only press event at this week’s CES 2017 in Las Vegas.
Lite-On will become the latest of a growing number of SSD vendors to embrace the 3D NAND technology for its vastly improved speed, performance, reliability, and cost benefits.
3D NAND is an emerging flash design where memory cells are stacked vertically and in multiple layers – a bit like a skyscraper to store more data at lower costs. It enables enterprise organizations to retain dramatically higher volumes of data for a lower cost per byte.
That’s likely one reason why the global 3D NAND flash market is projected to reach 9.7 billion units in 2020 at a CAGR of 89%, and explode at a petabyte growth of 129% from 2015-2010, according to Forward Insights.Add a comment