Introducing ROXIO Toast 16 Titanium and Toast 16 Pro, the latest versions of Roxio's powerful digital media and disc burning software for Mac. Toast now includes the new MultiCam Capture making it simple to capture synced footage from your screen, webcam, and supported cameras to help you create engaging video tutorials and presentations. Whether you're making videos for business or fun, Toast 16 with MultiCam Capture is the perfect companion to video editing software like iMovie and Final Cut Pro.
MultiCam Capture in Toast 16 captures all your footage simultaneously, even audio from a high-quality microphone, so there's no post-capture syncing required. Use MultiCam Capture to quickly capture great-looking video footage from multiple angles and your screen. Then import your synced footage into your favorite video editing software to create your final production. With multiple angles recorded, you can explore a variety of creative options, including picture-in-picture effects or switching between camera angles to add interest and draw in viewers.
"With new MultiCam Capture, Toast 16 offers an incredibly powerful video capture and screen recording application. By recording and syncing footage on the fly, you can now easily engage with your audience from any angle. Whether you're creating software training, unboxing videos, or cooking demos, it's never been simpler to capture dynamic content to grab your audience's attention," said Michel Yavercovski, Senior Director of Product Management for Roxio. "Longtime video makers and aspiring YouTube vloggers alike will find MultiCam Capture to be a powerful addition to their video editing toolkit."Add a comment
ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, today launched industrial-grade ISSS314 solid state drives in 3D MLC and 3D TLC versions. All models can withstand a wide temperature range, extreme shocks and vibrations, as well as humidity to meet the needs of industrial users. Using hardened and carefully sorted components, ISSS314 SSDs consume just 2.5W to lower operating costs while providing speedy 560MB/s read and 520MB/s write. They are offered in 3D MLC and 3D TLC NAND plus capacities ranging from 32GB to 512GB in order to better cover and serve as many budgets and needs as possible.
Benefits of 3D NAND for industrial users
The increased durability and power efficiency of stacked NAND Flash compared to older planar NAND offers very appealing advantages in applications that require non-stop and long term use. The ISSS314 range has an MTBF of 2 million hours, which is 25% more than comparable 2D NAND drives. At the same time, they consume just 2.5W per drive while reaching 512GB in capacity. Modest power draw translates into major electricity savings over the life of the drive, especially in large installations where many units are needed. Across the range, ISSS314 drives reach 560MB/s read and 520MB/s write.
Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, unveils its new TwoDrive with Lightning and USB3.0 connectors. Super Talent’s TwoDrive is a high-speed flash drive with Lightning and USB 3.0 dual end connectors to quickly and easily transfer files between devices, and works with use of free STT Mobile Manager app from App Store. The TwoDrive flash drive features a rotational connector design to allow user to swing the Lightning plug while the plug is in use.
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ADATA Technology, a leading manufacturer of high performance DRAM modules, NAND Flash products, and mobile accessories today launched the SE730H external solid state drive, an update of the best-selling SE730. The SE730H performs at 500MB/s read and write, and moves to 3D TLC NAND for increased durability and longevity, while remaining one of the most compact external SSDs worldwide. It has a reversible USB-C connector for greater convenience, and a stylish metallic design. Data transfers use USB 3.1 Gen 2 (up to 10Gbps). Importantly, the SE730H meets IEC IP68 dust and water proof requirements, as well as military-grade shock mitigation standards. Available in 256GB and 512GB, the SE730H is Windows, Mac OS, and Android compatible for seamless cross-platform usage.
Super compact with the benefit of 3D NAND
While previous generation SE730 drives were only available in 250GB, the shift to high quality 3D TLC NAND has allowed ADATA to offer the SE730H in up to 512GB. At the same time, the SE730H maintains is compact footprint as the smallest device in its class (external USB-C 3D NAND SSD). It weighs a mere 33g, and users can choose from gold or red metallic color schemes. With 3D TLC NAND, the SE730H delivers more than just bigger capacity: 3D NAND is also around 25% longer-lasting than 2D NAND, and more reliable for the life of the product while consuming less power, a plus for paired device batteries. In terms of performance, the SE730H reaches 500MB/s read and write, or about five times the speed of external mechanical drives.
QNAP Systems, Inc. today announced the new business-class AMD-powered TS-x73U series NAS; available in 8, 12 and 16-bay models with single and redundant power supply options. With a high-performance AMD Embedded R-Series RX-421ND quad-core CPU (2.1 GHz base, 3.4 GHz boost), a pre-installed dual-port 10GbE SFP+ network card, and two M.2 SATA 6Gb/s SSD slots (for empowering SSD caching to realize optimized storage efficiency with Qtier™ technology), the rack-mountable TS-x73U series is ideal for business organizations looking for a secure private cloud and efficient IT infrastructure for 10GbE networks.
With a dual 10GbE configuration, the TS-x73U series is capable of delivering up to 1,567 MB/s throughput, while the accelerated encryption engine with AES-NI enables unmatched encryption performance of up to 1,244 MB/s to boost system performance. Coupled with high scalability, the 10GbE-ready TS-x73U series satisfies virtualization and fast backup/restoration requirements for an ever-growing amount of data that demands higher bandwidth, and facilitates day-to-day operations with greater productivity.Add a comment
ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, today launched its XPG GAMMIX product series, first shown at Computex 2017. The debut consists of the GAMMIX S10 PCIe3x4 NVMe 1.2 M.2 2280 SSD, capable of 1800MB/s read and 850MB/s write thanks to premium 3D NAND in up to 1TB capacity. The S10 features a stylish heatsink for expedited heat dissipation. It is joined by GAMMIX D10 DDR4 memory modules, which likewise boast a custom heatshield to ensure lower temperatures and more stable performance. They are offed in black and red colors, and in up to 3000MHz factory speeds with a starting speed of 2666MHz on new Intel X299 motherboards. The GAMMIX line provides gamers, PC DIY enthusiasts, and overclockers with additional options that combine performance and design, stemming from the core XPG mission statement of ensuring better experiences.
GAMMIX S10: PCIe3x4 NVMe 1.2 M.2 with a cool twist
With speeds up to 1800MB/s read and 850MB/s write, the S10 leverages the efficiency of the M.2 2280 form factor and the NVMe 1.2 protocol to better serve performance seekers, from gamers to graphics professionals. It cuts down data transfer waits, loading times, and seek latency, and packs up to 1TB 3D TLC NAND driven by an SMI controller. The custom-designed XPG heatsink ensures temperatures are at least 10 degrees Celsius lower than non-shielded M.2 SSDs, promoting stability and longevity. DRAM and SLC caching help maintain peak performance, with read/write IOPS ratings of 130K/140K. The S10 further supports LDPC error correction, and has a 2 million hour mean time before failure rating. It arrives backed by a 5-year warranty. In addition to 1TB, customers can choose from 128GB, 256GB, and 512GB models.
Toshiba Memory Corporation, the world leader in memory solutions, today announced development of the world’s first BiCS FLASH™ three-dimensional (3D) flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this groundbreaking device will be showcased at the 2017 Flash Memory Summit in Santa Clara, California, United States, from August 7-10.
Devices fabricated with TSV technology have vertical electrodes and vias that pass through silicon dies to provide connections, an architecture that realizes high speed data input and output while reducing power consumption. Real-world performance has been proven previously, with the introduction of Toshiba’s 2D NAND Flash memory.Add a comment
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its new semiconductor fabrication line in Pyeongtaek, South Korea, has begun mass production and shipping its first product to customers. The new facility will focus on the production of Samsung’s fourth-generation V-NAND (64 layers), adding to the company’s leading capacity for cutting-edge memory products.
“With the dedication and support of our employees, customers and partners, our new Pyeongtaek campus represents a new chapter in Samsung’s semiconductor operations,” said Oh-Hyun Kwon, Vice Chairman and Chief Executive Officer of Samsung Electronics.
With two years of construction since it broke ground in May, 2015, the fabrication line at the Pyeongtaek campus is currently the largest single Fab in the industry.Add a comment
ADATA Technology, a leading manufacturer of high performance DRAM modules, NAND Flash products, and mobile accessories today launched the HD710 Pro durable external hard drive alongside an addition to the best-selling HD650 range. The HD710 Pro improves on its HD710 predecessor by exceeding IP68 dust and water proofing plus military-grade shock resistance. It enhances the safeguarding of stored data against accidents, damage, and the rigors of active lifestyles, and is available in four colors. The HD710 Pro offers up to 4TB capacity. The refreshed HD650 arrives in a stylish light blue over black color scheme, also providing 4TB capacity – a new milestone for unpowered USB external hard drives. Together, these two new USB 3.1 models bolster the ADATA external hard drive portfolio, giving consumers more choice.
HD710 Pro: more durable and bigger than before
The original HD710 proved quite successful for ADATA on Windows, Linux, and Mac OS. The HD710 Pro improves on it with enhanced dust and water proofing that boosts its durability for use in harsh environments and the outdoors. It exceeds IEC IP68 requirements, being completely dust-tight and able to withstand up to 60-minute submersion in 2 meters of water. It also meets and passes MIL-STD 810G 516.6 requirements, surviving shocks and impacts associated with drops from up to 1.5 meters. The HD710 Pro uses a custom triple-layered protective build and implements G-Shock sensor technology that stops and restarts drive activity when shocks or vibrations are detected to prevent data corruption. The drive features an ergonomic USB port cover for effortless open/close, and a useful wraparound groove for storing its USB cable. Red, yellow, and blue variants are available in 1TB/2TB, while the black version goes up to 3TB/4TB.
Western Digital Corp., a global data storage technology and solutions leader, today announced that it has successfully developed its next-generation 3D NAND technology, BiCS4, with 96 layers of vertical storage capability. Sampling to OEM customers is expected to commence in the second half of calendar year 2017 and initial production output is expected in calendar year 2018. BiCS4, which was developed jointly with Western Digital's technology and manufacturing partner Toshiba Corporation, will be initially deployed in a 256-gigabit chip and will subsequently ship in a range of capacities, including a terabit on a single chip.
"Our successful development of the industry's first 96-layer 3D NAND technology demonstrates Western Digital's continued leadership in NAND flash and solid execution to our technology roadmap," said Dr. Siva Sivaram, executive vice president of memory technology at Western Digital. "BiCS4 will be available in 3-bits-per-cell and 4-bits-per-cell architectures, and it contains technology and manufacturing innovations to provide the highest 3D NAND storage capacity, performance and reliability at an attractive cost for our customers. Western Digital's 3D NAND portfolio is designed to address the full range of end markets spanning consumer, mobile, computing and data center."Add a comment