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BiTMICRO announced today that it has completed the first production units of its maxIO PCIe SSD, its new enterprise-class solid state drive.
MaxIO SSDs feature BiTMICRO’s recently announced Talino Architecture, which integrates their Quad-Core Talino ASIC, delivering 400,000 random 4KB IOPS on a single controller. Talino handles data processing without wasting critical server resources.
“These first maxIO SSDs begin BiTMICRO’s entry into the enterprise market,” states Zophar Sante, VP of Marketing and Sales. “For over a decade we have designed and manufactured SSDs for highly demanding defense and industrial customers. We’re leveraging our experience with mission-critical applications to deliver new feature-rich, high performance and extremely durable SSDs to the enterprise.”
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Silicon Power, the world’s leading provider of memory storage solutions today announces a brand new series of flash cards - the Elite UHS-1 series. The Elite UHS-1 series contains a complete product roadmap ranging from SDHC, SDXC to microSDHC and microSDXC, ready for all types of devices such as DSLR, Smartphones, tablets and camcorders. With the combination of the large capacity up to 64GB and the remarkable transmission rate reaching at 50MB per second in reading, the Elite UHS-1 series is the ideal gadget for high-speed consecutive picture taking, extended length of Full-HD videos and images, as well as massive storage for all your cherish memories.
SP Elite UHS-1 series is compliant with the SDA Memory Card Standard Version 3.0.1 and the Ultra High Speed Class 1 specification (UHS-1). Compared to SD 2.0, the Elite series presents a tremendous improvement in terms of transmission performance in reading and writing. By offering a whole new photographic experience in high-speed photo shooting and video capturing, the Elite UHS-1 series is your perfect selectoin for DSLR, camcorders, smartphones and tablets users.
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Today, LaCie expands its industrial-strength storage line with the faster, stronger XtremKey USB 3.0. Designed for users who want to push the limits with their technology, the robust LaCie XtremKey can challenge the most severe conditions.
The LaCie XtremKey received multiple awards for its innovative, rock-solid design. With wear-resistant screw threads and a rubber O-ring, the LaCie XtremKey is waterproof up to 200 meters. "The unique design is inspired by a waterproof screwing closure and thick metal casing," said product line manager Luc Pierart. "When the seam is sealed, the aerodynamic key can withstand extra ordinary circumstances."
Like its predecessor, the latest LaCie XtremKey features a protective cap made of thick ZAMAC metal alloy. Its strength can withstand severe shock, dizzying drops, and the relentless pressure of a 10-ton vehicle. It also survives bone chilling temperatures down to -30°C, and scorching heat up to 200°C.
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Solid state drive (SSD) is gradually making its way to become the mainstream in 3C product market. Team Group Inc., one of the leading memory manufacturers in the world, is making improvement in SSD product development by launching the ultra-thin Team Ultra L1 SSD. As thin as 7mm, the Team Ultra L1 SSD is the most lightweight and compact model which can be installed directly onto new generation of Ultrabooks for faster booting and read/write speed. Combined with the inherent advantage of shock resistance and stability of SSD, it signifies significant improvement of computer performance and durability.
Team Ultra L1 SSD is provided with SATA III 6Gb/s high-speed interface. The compact profile and special titanium color finishing highlight the product’s high quality and the sense of modern technology. The continuous read and write speeds go as high as 550MB/s and 520MB/s, respectively. The random write-in speed for small files of 4K reaches up to 80,000 IOPS, not only fast but stable. In addition, the integration of Dura Write and RAISE (Redundant Array of Independent Silicon Elements) provides support for S.M.A.R.T. and full compatibility with Win7 Trim commands. It gives the hard drive a boost of burst random writing and effective improvement of computer’s ability to respond and multiplexing performance, making the hard drive a storage solution of extreme speed for consumers.
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VIA Labs, Inc., a leading supplier of USB 3.0 integrated chip controllers, today announced its two latest USB 3.0 device controllers, the VIA VL752 and VIA VL753 SuperSpeed USB 3.0 to NAND flash controllers. The VIA VL752 and VIA VL753 deliver enhanced performance using the latest NAND flash technologies including 19nm, 20nm and 21nm geometries and have been certified by the USB Implementers Forum (USB-IF) for SuperSpeed operation, ensuring high quality, seamless interoperability, and effortless backwards compatibility.
The two-channel the VIA VL752 and single-channel VIA VL753 offer data transfer speeds up to 280MB/s, flexible bad block management, support for the latest 200MHz DDR NAND Flash, and a robust ECC engine for greater data integrity. The package sizes from the previous generation of VIA Superspeed USB to NAND flash controllers have been reduced to a QFN68 8 x 8mm package for the VIA VL752 and a QFN48 6 x 6mm package for the VIA VL753 to enable the smallest form-factor designs.
