- Details
- Other
Leading memory provider, TEAMGROUP, has tapped into T-FORCE LAB's superb R&D capabilities to create the latest iteration of the T-FORCE XTREEM DDR5 memory. By utilizing a patented IC classification test and verification technology, the upper limits of the DDR5 frequency have been raised to create a high-clock rate memory module designed specifically for gamers. Decorated with the glorious T-FORCE logo badge, the XTREEM's design exudes both confidence and style, befitting the newest king of overclocking memory modules.
T-FORCE XTREEM DDR5 memory demonstrates incredible overclocking performance to satisfy overclocking enthusiasts around the world. Not only using 2mm-thick aluminum alloy fin heatsinks to enhance its thermal capacity, but also uses special heat-conducting silicone to tightly adhere the heatsinks with the memory to achieve the most optimal cooling effect. The surface is also treated with an anodized surface that is resistant to acid, corrosion, rust and is non-electrically conductive, providing gamers with greater peace of mind. The T-FORCE XTREEM DDR5's two-piece heat spreader is made of thick metal and underwent sandblasted surface treatment to give it the appearance of hard basalt and the matte black texture reminiscent of a black sand beach. Users can enjoy the excellent overclocking capabilities of the XTREEM DDR5 while admiring its elegant design.
Add a comment- Details
- Other
CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today launched the much anticipated latest addition to its award-winning memory line-up, DOMINATOR TITANIUM DDR5 memory. Built using some of the fastest DDR5 ICs alongside patented CORSAIR DHX cooling technology for improved overclocking potential, DOMINATOR TITANIUM continues the DOMINATOR legacy with a stunning design and blazing performance.
Sporting an elegant, fresh new aesthetic and built using premium materials and components, DOMINATOR TITANIUM DDR5 memory will be available for both Intel and AMD platforms, supporting Intel XMP 3.0 when paired with 12th and 13th-Gen Core processors or AMD EXPO for Ryzen 7000 CPUs. These technologies enable easy overclocking in just a couple of clicks on compatible platforms.
Add a comment- Details
- Other
T-CREATE, the creator sub-brand of the global memory provider TEAMGROUP, today launched the T-CREATE MASTER DDR5 OC R-DIMM, an overclocking DDR5 ECC Registered DIMM memory. T-CREATE's MASTER series is designed specifically for workstations and servers. With its high specifications and large capacity, it fully satisfies the needs of professionals in handling large-scale projects, analyzing large data sets, and running multiple specialized applications concurrently. The T-CREATE MASTER DDR5 OC R-DIMM features a one-piece heat spreader with ventilation holes and thermally conductive silicone for quick heat dissipation. It also has on-die ECC, which allows systems to run more stably and provide excellent performance.
The T-CREATE MASTER memory module is an overclocking ECC Registered DIMM memory available in frequencies of 6000 MHz, 6400 MHz, and 6800 MHz. When the module is paired with workstation motherboards, memory capacity can reach up to a massive 384GB, allowing professional creators to quickly complete all types of work and enjoy the creative flexibility that comes with large capacities. In addition to the on-die ECC that corrects bit errors within the DRAM chip, the MASTER memory also supports an ECC feature that corrects errors outside the chip and fixes data corruption, allowing for stable operation and greater peace of mind when creating. The MASTER R-DIMM is compatible with W790 series workstation motherboards and is made for creative professionals, developers, and engineers. When combined with the powerful computing of the latest Intel Xeon processors, the T-CREATE MASTER DDR5 OC R-DIMM memory delivers incredible performance and stability for content creation, graphic rendering, and the demanding applications of high-end workstations.
Add a comment- Details
- Other
In order to meet the evolving needs of Netcom data center computing, global memory provider TEAMGROUP is proud to introduce the new DDR5 VLP ECC U-DIMM normal and wide temperature (-40° to +85°C) memory module. It features DDR5 high performance, high frequencies, and large-capacity industrial ICs. Designed to have an extremely low profile for greater performance and more compact hardware configurations, the U-DIMM provides users with better performance and reliability than ever before.
TEAMGROUP's DDR5 VLP ECC U-DIMM memory modules come in frequencies up to 4800 MHz and 5600 MHz to ensure fast data processing and enhance computing performance. The memory is also offered in a wide range of capacity options, from 16GB to 48GB, allowing users to select the most suitable capacity kit for their platform's workload and computing needs. This module comes in an ultra-low-profile design, with a board height of only 0.738 inches, half of the normal modules. This allows it to meet the hardware configuration requirements of blade servers and helps maximize space for the user’s configuration of components, and achieves higher server density.
Add a comment- Details
- Other
Global memory brand TEAMGROUP announced the launch of its updated ELITE memory modules with enhanced frequencies today: the ELITE PLUS DDR5 and ELITE DDR5 Desktop Memory 6400MHz (1.1V CL52-52-52-103). Both comply with JEDEC memory standards and fulfill the needs of demanding applications and high-performance computing.
In response to the growing demand for high-speed computing and digital technology, TEAMGROUP has introduced the upgraded ELITE PLUS DDR5 6400MHz and ELITE DDR5 6400MHz memory modules, which boast higher frequencies and low power consumption. The updated specs of the ELITE memory fully meet the needs of learning, entertainment, and more on desktop computers. With the modules’ low operating voltage of 1.1V, power consumption is significantly reduced, and the computer’s lifespan is extended. In addition, DDR5's Same-Bank Refresh feature and optimized IC structure can process the double amount of data simultaneously compared to DDR4, which enables computers to operate more smoothly while multi-tasking and significantly improves operating efficiency.
Add a comment- Details
- Other
The leading memory brand TEAMGROUP has upgraded the capacities of its industrial DDR5 series memory products, by leveraging its outstanding R&D and product design capabilities, taking the lead in launching a 48GB module, as well as a lower 24GB option. The capacity upgrades apply to all types of DDR5 products, including the DDR5 non-ECC U/SO-DIMM, DDR5 ECC U/SO-DIMM class, and DDR5 ECC R-DIMM memory modules. They provide higher capacity for applications using high-performance edge computing, embedded computers, personal workstations, and more.
Current industrial DDR5 memory on the market has a maximum capacity of about 32GB per module. However, with the development of technologies such as cloud, edge computing, the Internet of Things, and big data, the demand for memory capacity is increasing. Edge computing systems need to process large amounts of data from a variety of sensors and devices and perform complex calculations and analyses that require high memory capacity and performance. To meet this demand, TEAMGROUP has made capacity upgrades across its industrial DDR5 memory products, offering new 24GB and 48GB modules. They bring more application flexibility and enable users to better handle large data sets, complex simulations, and analysis tasks. The enhanced capacities will significantly increase the performance and processing power of edge computing systems, providing users with the ability to run various applications and algorithms more efficiently.
Add a comment- Details
- Other
XPG, the e-sports arm of ADATA, the world's leading memory brand, specializes in creating high-performance and stunningly designed e-sports products for e-sports enthusiasts, technology-minded gamers, and overclockers. XPG today announced the launch of LANCER BLADE RGB DDR5 and LANCER BLADE DDR5 memory, emphasizing its low-profile heatsink design, freeing motherboard assembly from heatsink height, and providing a profile that is perfect for small cases with limited space. The XPG LANCER BLADE series includes two models with top speeds of 6000MT/s and 6400MT/s.
By utilizing high-quality carefully selected Hynix chips, these memory modules are low latency and easy to overclock while allowing gamers to enable a hassle-free speed boost with one-click overclocking. At the same time, The XPG LANCER BLADE series supports Intel XMP 3.0 and AMD EXPO and is compatible with the latest Intel and AMD platforms, ensuring excellent memory stability and a smoother operating experience when multitasking or running large-scale applications. In addition, the XPG LANCER BLADE series adopts a high price-performance strategy, combined with excellent operation and quality, it is definitely the foremost choice when gamers upgrade their systems.
Add a comment- Details
- Other
Leading storage product brand, TEAMGROUP, is releasing its industrial wide temperature storage product series, ULTRA, in view of the fast-developing electric vehicle market. Consumer products typically operate within a temperature range of 0–70℃. However, industrial products are designed to withstand harsh environments and operate within a temperature range of -40–85℃. Because of the extreme temperature differences in applications such as vehicle computer systems, storage products with higher tolerance and compliance with automotive temperature grades are required. In response to the developments in EVs, TEAMGROUP has launched a new storage product series that includes an SSD and memory module and can handle temperatures of up to 105℃, the highest in the industry. The company is targeting the vehicle, fanless embedded, and rugged computer markets.
TEAMGROUP's industrial ULTRA wide-temperature storage product series uses Major Grade high-quality ICs and patented testing and grading technology (Taiwan Invention Patent No. I751093; US Invention Patent No. US11488679) and ultra-thin graphene cooling technology (Taiwan Invention Patent No. I703921; US Invention Patent No. US11051392B2), allowing stable operation in harsh temperatures. In addition, the ULTRA wide-temperature storage product series has passed the ISO-16750 Road Vehicles (environmental conditions and testing for electrical and electronic equipment in road vehicles) - 5.1.2 high-temperature 105℃ verification test. Both products also meet standards for military-grade impact resistance (MIL-STD-202G, MIL-STD-883K) and shock resistance (MIL-STD810G), guaranteeing their stability and durability. Whether it's maintaining data security or overcoming extreme conditions in automotive and industrial applications, the ULTRA storage product series will fully satisfy your needs.
Add a comment- Details
- Other
Micron Technology, Inc.,today announced volume production availability of high-capacity 96GB DDR5 RDIMMs in speeds up to 4800MT/s, which have double the bandwidth compared to DDR4 memory. By unlocking the next level of monolithic technology, the integration of Micron’s high-density memory solutions empowers artificial intelligence (AI) and in-memory database workloads and eliminates the need for costly die stacking that also adds latency. Micron’s 96GB DDR5 RDIMM modules are qualified with 4th Gen AMD EPYC™ processors. Additionally, the Supermicro 8125GS — an AMD-based system — includes the Micron 96GB DDR5 modules and is an excellent platform for high-performance computing, artificial intelligence and deep learning training, and industrial server workloads.
“Delivering high-capacity memory solutions that enable the right performance for compute-intensive workloads is essential to Micron’s role as a leading memory innovator and manufacturer. Micron’s 96GB DDR5 DRAM module establishes a new optimized total cost of ownership solution for our customers,” stated Praveen Vaidyanathan, vice president and general manager of Micron’s Compute Products Group. “Our collaboration with a flexible system provider like Supermicro leverages each of our strengths to provide customers with the latest memory technology to address their most challenging data center needs.”
Add a comment- Details
- Other
Golden Emperor International Ltd. – one of the world's leading PC components & peripheral manufacturers today announced the latest Pristine R5 series as well as Spear R5 series server memory products, providing solutions not only for the needs of standard Registered DIMMs which fully complies with the JEDEC specifications but also the market of high-end applications which requires high-performance server memory.
GeIL stated that the popularity of online games and the metaverse brings not simply the growth momentum of the server market, related requirements such as the gaming service, the big data analysis, and AI applications also create the massive needs of cloud computing which customers are now asking for great performance rather than just focusing on stability, reliability and security when it comes to the server products. GeIL further pointed out that the demand for high-bandwidth and large-capacity server memory is therefore continuously and rapidly growing.
Add a comment
