Toshiba Unveils XFMEXPRESS Technology For Removable NVMe Memory Devices
Toshiba Memory Corporation, the world leader in memory solutions, today announced XFMEXPRESS, a new technology for removable PCIe attached, NVMe memory devices. With a new form factor and an innovative connector, XFMEXPRESS technology delivers an unparalleled combination of features designed to revolutionize ultra-mobile PCs, IoT devices and various embedded applications. Recognizing the need for a new class of removable storage, Toshiba Memory leveraged its extensive background in single package memory designs to develop XFMEXPRESS technology and offer these key features:
Game-Changing Serviceability
Putting serviceability front and center, XFMEXPRESS technology enables a new category of small memory devices and SSDs that are easy to service or upgrade. By pairing a robust, compact package with removable memory functionality and flexibility, XFMEXPRESS technology will help diminish technical barriers and design constraints.
Mobile-Friendly Footprint
The XFMEXPRESS form factor’s no-compromise size and low profile (14mm x 18mm x 1.4mm) offers a 252mm2 footprint, optimizing the mounting space for ultra-compact host devices without sacrificing performance or serviceability. With this minimized z-height, the XFMEXPRESS form factor is excellent for thin and light notebooks and creates new design possibilities for next-generation applications and systems.




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