Transcend Information, Inc. (Transcend) a leading manufacturer of storage and multimedia products, is proud to introduce the dual-access JetFlash 890S OTG (On-The-Go) Flash Drive. The JetFlash 890S features USB 3.1 Type-A connector on one end and USB 3.1 Type-C on the other for fast and easy transfer between the latest laptops, PCs and handheld devices such as smartphones and tablets. With the rising trend of capturing photos and recording videos on mobile devices, the JetFlash 890S enables users to instantly share and store those images across multiple devices and operating systems.

Type-C standard is expected to be widely adopted to various platforms and devices as major computer manufacturers, such as Apple, Google and Asus, have recently released new laptop models with Type-C USB port. Featuring a reversible plug, the JetFlash 890S with the latest USB Type-C standard on one end prevents any possibility to try several times before actually being plugged into the USB port. On the other side of the JetFlash 890S is a regular Type-A connector backwards compatible with USB 2.0. The JetFlash 890S supports USB 3.1 Gen 1 with ten times the bandwidth faster than USB 2.0.

Kingston Digital Europe Co LLP, an affiliate of Kingston Technology Company Inc., the independent world leader in memory products, today announced the addition of a 512GB capacity to its line of Class 10 UHS-I SDHC/SDXC cards. The higher capacity card is ideal for DSLR cameras and HD camcorders as it allows users to record more video and shoot more high-density image files without running out of space.

In addition to storing thousands of photos and hours of video , the card provides speeds of 90MB/s read and 45MB/s write. These high speeds support photography in continuous and burst modes, and reduces stutter to ensure video integrity. Class 10 UHS-I SDHC/SDXC cards also allow users to shoot full 1080p HD video and 3D video as well as transfer files faster. In addition to the new 512GB capacity, this card is also available in 16GB, 32GB, 64GB, 128GB and 256GB.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it is adding three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its industry-leading portfolio of advanced enterprise and data center SSDs. The drives are available now.

“We are providing high-end capabilities and capacities for all of our latest SSDs, something we believe will elicit a high degree of interest from OEMs and computer enthusiasts throughout the world,” said Jim Elliott, corporate vice president, Samsung Semiconductor, Inc. “We understand the performance needs of our customers in a rapidly expanding SSD universe and are determined to meet those needs.”

Designed for OEMs, Samsung’s new SSDs – the PM1633, PM1725 and PM953 all utilize Samsung’s 3-bit MLC (multi-level-cell) V-NAND flash memory, while providing outstanding performance and reliability, as well as high capacities.

Toshiba Corporation’s Semiconductor & Storage Products Company today announced three distinct families of PCIe (Peripheral Component Interconnect Express) solid state drive (SSD) products using NVMe (Non-Volatile Memory Express) protocol, targeted for various applications including high performance notebooks; thin notebooks, 2-in-1/convertible notebooks and tablets; and server and storage applications. All three SSD product lines are optimized for high performance and low latency and utilize the PCIe interface, which provides point-to-point links with the processor, reducing system bottlenecks. Each SSD family is designed for its target segment with capacity, optimized form factor, and security capabilities. Samples of the Toshiba’s newest lines of NVMe, PCIe SSDs will be available from the fourth quarter (Oct. to Dec.) of 2015.

High Performance Notebooks: The XG3 family of SSDs is the industry’s highest capacity (1024GB) client NVMe SSD available in M.2 Type 2280 form factor and optimally designed for high performance notebooks, 2-in-1 PCs and all-in-one PCs. The XG3 in M.2 Type 2280 form factor supports up to four lanes of PCIe 3.1, which has a maximum interface bandwidth more than six times that of SATA 6Gbits/s. XG3 is also the industry’s first NVMe SSD available in 2.5-inch SATA express form factor. The XG3 SSD family is equipped with Toshiba’s proprietary QSBCTM (Quadruple Swing-By Code) error-correction technology, a highly efficient error correction code (ECC), which helps protect customer data from corruption, improves reliability, and extends the life of Toshiba SSDs. Engineered for power efficiency, the XG3 series also features lower power state modes and is the first Toshiba product, along with the BG1 SSD family, to support the Trusted Computing Group specification, Pyrite (TCG Pyrite).