The most beautiful memories deserve preservation with the highest video specifications! The high-speed memory cards microSDXC UHS-I U3 V30 and the microSDHC UHS-I U1 V10 launched by Apacer are equipped with multiple protections and high durability to ensure uninterrupted video recording in the harsh environments! Offered in a maximum capacity of 256GB, the V30 memory card complies with SD Association’s latest UHS Video Speed Class 30 (V30) standard, meaning it can record at a minimum speed of 30MB per second to support 4K Ultra HD and 3D video recording and high-speed continuous shooting. Available in 16GB and 32GB, the V10 memory card supports Full HD recording demand and is perfect for devices requiring prolonged recording, such as dash cams and sports cameras.

V30 Video Speed - Designed for 4K Video Recording

The demand for 4K video recording has been escalating as sports and aerial photography has become a fashion in recent years. Although high-resolution videos bring more details and make images more vivid, the size of 4K video files also increases, dedicated high-speed memory cards are needed to ensure the perfect storage of every screen. With support for the continuous high-speed mode and a maximum reading speed of 100MB per second, Apacer V30 memory card is tailored for 4K video recording to significantly reduce file transmission time. It is now available in 64GB, 128GB, and 256GB to offer a maximum of 5.8 hours of 4K recording. Coupled with professional video recorders, smartphones, and digital cameras, users can capture every wonderful moment in daily life.

Western Digital Corporation, a data technology leader, today introduced the new Ultrastar DC SS530 SAS SSD, the company’s highest-density drive and the fastest dual-port SAS SSD in the market, enabling server and storage array manufacturers to offer customers substantially lower data center TCO for Fast Data applications. By doubling maximum capacity of the previous generation to 15.36TB within the same 2.5-inch 15-mm form factor, drive storage density also doubles, giving IT managers the potential to reduce the number of drives deployed, consolidate servers and open up valuable rack space for improved CapEx and OpEx costs.

Developed in partnership with Intel, the Ultrastar DC SS530 is based on a trusted third-generation platform that has been previously qualified at most major OEMs worldwide. It offers consistent performance and reliability to meet the rigorous demands of today’s toughest data center workloads. Designed with a 12Gb/s SAS interface, and available in capacities from 400GB to 15.36TB, the Ultrastar DC SS530 delivers up to 440,000 random read and 320,000 random write IOPS — providing rapid access to “hot” enterprise data for higher productivity and operational efficiency.

“Our proven history has garnered trust from leading server and storage system providers around the world. Through these partnerships we have deep expertise in tiered storage needs as well as the importance of delivering the highest reliability, cost-efficiency and ease of system integration,” said Ulrich Hansen, vice president of Enterprise Product Management at Western Digital. “With the Ultrastar DC SS530, we are releasing another high-quality product designed to meet the needs of our customers. Built on 64L 3D TLC NAND, the Ultrastar SS530 delivers important advances in performance and power efficiency. Combining these improvements with the reliability that our Ultrastar drives have become known to represent significantly enhances the value we deliver to the market.”

Today Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, has introduced a new lineup of solid state drives (SSDs) that are based on its 96-layer, BiCS FLASH™ 3D flash memory. The first SSD to use this breakthrough technology, the new XG6 series is targeted to the client PC, high-performance mobile, embedded, and gaming segments – as well as data center environments for boot drives in servers, caching and logging, and commodity storage.

As the inventor of flash memory and the first to introduce the concept of 3D flash memory, Toshiba Memory is driven to continually push the boundaries of what is possible – and move the technology forward. Its 3-bit-per-cell (triple-level cell, TLC) BiCS FLASH technology improves the performance, density and efficiency of SSDs. And its innovative 96-layer stacking process combines with advanced circuit and manufacturing technology to achieve a capacity increase of approximately 40 percent per unit chip size over 64-layer 3D flash memory.

Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced the development of a prototype sample of 96-layer BiCS FLASH, its proprietary three-dimensional (3D) flash memory, with 4-bit-per-cell (quad level cell, QLC) technology. With this milestone achievement, Toshiba demonstrates its technology leadership in the storage market by delivering technology that boosts single-chip memory capacity to the highest level yet achieved.

Toshiba’s new QLC BiCS FLASH significantly expands capacity by pushing the bit count for data per memory cell from three to four. The new product achieves the industry's maximum capacity of 1.33 terabits for a single chip, and a 16-die stacked architecture in a single package realizes an unparalleled capacity of 2.66 terabytes.

The number of applications needing huge amounts of storage continues to grow, fed by the enormous volumes of data being generated that need to be accessed and analyzed in real time. Social media, SSDs, edge computing, enterprise applications and the rapidly expanding data center storage market are all areas in which larger capacity storage is required – to name just a few. With the introduction of 96-layer QLC technology, Toshiba Memory enables the development of products that keep pace with the fast-moving storage market.

Western Digital Corp. today announced successful development of its second-generation, four-bits-per-cell architecture for 3D NAND. Implemented for the company’s 96-layer BiCS4 device, the QLC technology delivers the industry’s highest 3D NAND storage capacity of 1.33 terabits (Tb) in a single chip. BiCS4 was developed at the joint venture flash manufacturing facility in Yokkaichi, Japan with our partner Toshiba Memory Corporation. It is sampling now and volume shipments are expected to commence this calendar year beginning with consumer products marketed under the SanDisk brand. The company expects to deploy BiCS4 in a wide variety of applications from retail to enterprise SSDs.

“Leveraging Western Digital’s silicon processing, device engineering and system integration capabilities, the QLC technology allows 16 distinct levels to be sensed and utilized for storing data,” said Dr. Siva Sivaram, executive vice president, Silicon Technology and Manufacturing at Western Digital. “BiCS4 QLC is our second generation four-bits-per-cell device, and it builds on the learnings from our QLC implementation in 64-layer BiCS3. With the best intrinsic cost structure of any NAND product, BiCS4 underscores our strengths in developing flash innovations that allow our customers’ data to thrive across retail, mobile, embedded, client and enterprise environments. We expect the four-bits-per-cell technology will find mainstream use in all these applications.”

Pioneer Japan sent out a press release this morning, announcing two new commercial-grade Blu-ray Disc writers. Designed for the long-term preservation of electronic data, the BDR-PR1MC-W and BDR-PR1MA-W are certified by JIIMA (Japan Information Technology Association of Public Interest Corporation) and are capable of writing to BD-R, BD-R DL, BD-R TL (100GB) and BD-R QL (128GB) at 4x. The two drives are also compatible with Sony's long-term, 128GB BD-R media that will be available in late July. 

The main difference between the two is that the BDR-PR1MA-W can be used to check the recording quality of a disc. Using Pioneer's Error Rate Utility, the drive is able to measure the RSER (Random Symbol Error Rate) as well as the number of burst and uncorrectable errors on recordable Blu-ray media. In addition, the BDR-PR1MA-W can be used to measure PIE/POF on DVDs and BLER/CU on CDs.

Following the releases of the TS-932X (powered by an AnnapurnaLabs CPU) and the TS-963X (powered by an AMD CPU), QNAP Systems, Inc. today completes the high-capacity-compact-size 9-bay NAS lineup with the introduction of the TVS-951X 10GbE multimedia NAS. The new model is powered by a 7th-generation Intel® Kaby Lake processor, providing a NAS private cloud solution that combines high capacity and 10GbE high-speed connectivity. The TVS-951X NAS has also won the Red Dot Award (2018) and Computex d&i Award for high-quality product design.

Powered by a 7th-generation Kaby Lake 14nm Intel® Celeron® 3865U low-power dual-core 1.8 GHz processor, the TVS-951X features a hybrid drive bay design (including five 3.5-inch drive bays and four 2.5-inch SSD slots) with built-in 10GBASE-T (10G/5G/2.5G/1G/100M) network port. Combining hard drives and SSDs allow users to maximize both capacity and performance with SSD caching and Qtier auto-tiering storage. Combined with 10GbE connectivity, multimedia transcoding/streaming, and 4K HDMI output, the TVS-951X provides users with a cost-effective, highly-efficient, and high-performance NAS solution with feature-rich multimedia applications.