Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, proudly presents its first-ever PCIe 3.0 NVMe solid-state drive – the COLORFUL WarHalberd CN600. COLORFUL collaborated with Yangtze Memory (YMTC) and Maxio Technology for the CN600 SSD. The cooperation between the companies will ensure the quality and performance of the flash components and the NVMe controller.

The COLORFUL WarHalberd CN600 NVMe SSD is a low-profile NVMe SSD in a standard 2280 M.2 form factor, designed for desktop PCs, laptops, ultrabooks, and mini-PCs. Using PCIe 3.0 X4 interface, the WarHalberd CN600 delivers speeds of up to 3300MB/s read and up to 2600MB/s write. The SSD will be offered in 256GB and 512GB capacities.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the PM1743 SSD for enterprise servers, integrating the PCIe (Peripheral Component Interconnect Express) 5.0 interface with Samsung's advanced sixth-generation V-NAND.

"For over a decade, Samsung has been delivering SATA, SAS and PCIe-based SSDs that have been recognized for outstanding performance and reliability by leading enterprise server customers including corporations, governments and financial institutions," said Yong Ho Song, Executive Vice President and Head of the Memory Controller Development Team at Samsung Electronics. "The introduction of our PCIe 5.0 SSD, along with PCIe 6.0-based product developments that are underway, will further solidify our technological leadership in the enterprise server market."

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces it will be on location in Las Vegas during the 2022 CES show (Jan. 5-8). Under the theme of ‘Dawn of a New Xtreme,’ it will be showing off the latest products from XPG and ADATA including gaming systems, peripherals, accessories, and components, such as the newest DDR5 memory, PCIe 5.0 solid state drives (SSD) and the latest state-of-the-art Platinum PSU. The booth can be found at the Venetian, Titian Ballroom, #2202.

Next-Gen SSD and DRAM Performance
XPG’s and ADATA are gearing up to bring next-generation performance to gamers and other users with its latest PCIe Gen5x 4 SSDs and DDR5 DRAM. At the booth, visitors will get a first look at the XPG LANCER RGB DDR5 and CASTER RGB DDR5 that deliver next-level performance of up to 6000 MT/s and 7000 MT/s, respectively. ADATA’s industrial-grade DDR5-4800 U/SO/R-DIMM memory with on-die ECC & PMIC will also be on display.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces the XPG CASTER DDR5 DRAM series. The XPG CASTER, which comes with and without RGB lighting, is rated for 7000 MT/s and comes equipped with On-Die ECC and PMIC for enhanced stability and reliability. Both the RGB and non-RGB variants feature capacities of 16GB.

Next-Generation Performance
Running at 7000 MT/s, the XPG CASTER is a new breed of DDR5 that is over two times faster than standard DDR4 DRAM. With blazing-fast data transfer rates, users will enjoy a smoother and seamless gaming experience. With support for Intel® XMP 3.0, overclocking is incredibly and straightforward. It allows users to avoid cumbersome BIOS settings and never-ending adjustment of overclocking parameters.

CDRLabs has taken yet another look at Crucial's popular MX500 series SSD. This time around, we've reviewed the 4TB version of the drive which combines Silicon Motion's SM2259 controller with Micron's industry-leading 176-layer 3D TLC NAND flash to deliver 560 MB/s read and 510 MB/s write speeds. Like the other drives in the series, the 4TB MX500 also offers a long list of features including AES 256-bit encryption, thermal and power loss protection, TRIM support and active garbage collection. It also comes equipped with Crucial's Dynamic Write Acceleration technology, which uses an adaptable pool of high speed, single-level cell flash memory to enable faster saves and file transfers.

Managing massive datasets is excessively complex and costly. Today, Seagate Technology Holdings plc, a world leader in mass-data storage infrastructure solutions, announced the new Exos® Application Platform (AP) with a new controller featuring 2nd Gen AMD EPYC™ processors. The efficient, scalable, affordable end-to-end compute and storage platform delivers integrated compute and storage in a single enclosure optimizing rack space utilization, power efficiency, heat dissipation, and storage density.

The need for advanced storage solutions continues to rise to unprecedented levels with the ever-increasing growth in data generation. According to a report commissioned by Seagate and conducted by the research firm IDC, Rethink Data, enterprise data is expected to grow at an average rate of 42.2% over the next two years. The survey, which was conducted by IDC, also found that only 32% of data available to enterprises is put to work. The remaining 68% is unleveraged.

Leading global memory provider TEAMGROUP has been actively expanding in the industrial control field for many years. With the arrival of the new DDR5 generation, the company today announced the DDR5 ECC DIMM and DDR5 R-DIMM Industrial Server Memory modules. In recent years, there has been a steady growth in AI and HPC data applications, driving memory specifications toward higher capacities and greater performance. To meet this rising demand, TEAMGROUP has created multiple solutions with its latest innovations of DDR5 industrial server memory.

Its next-gen server memory modules can reach speeds of 6,400MT/s, come with a maximum capacity of up to 128GB, and operate at 1.1V, resulting in lower overall power consumption. The memory also features two innovations in its power supply architecture and channel architecture. The new power supply architecture shifts power management from the motherboard to the DIMM itself, enhancing signal integrity and resistance to interference. The channel architecture is updated with two independent sub-channels per memory module (DIMM) to significantly improve memory access efficiency and meet the elevated demands of smart platform applications.