The XPG SX8200 Pro comes in a small black box. Along with a picture of the drive, the front advertises many of its key features including its 512GB capacity, PCIe Gen3x4 interface, NVMe 1.3 support and 3D NAND. The back of the box provides a bit more information regarding the SX8200 Pro's features and performance. Inside, you'll find the SSD as well as a black, aluminum heatsink that can be attached to the drive.

Physical Features:

The XPG SX8200 Pro uses the 2280 form factor for M.2 (NGFF) SSDs. It measures 22 x 80 x 3.5 mm and tips the scales at a mere 8g. The drive also has an "M key" edge connector which provides PCIe SSDs with up to 4x lanes of bandwidth.

Like ADATA's XPG Gammix S11 Pro SSD, the SX8200 Pro uses Silicon Motion's SM2262EN controller. This 8 channel, PCIe Gen 3 x4 SSD controller is powered by a dual ARM Cortex CPU and offers support for 3D NAND from the main flash suppliers. The SM2262EN also employs Silicon Motion's proprietary NANDXtend error-correcting code (ECC) technology to enhance the endurance and retention of 3D NAND.

For the 512GB version of the SX8200 Pro, ADATA has opted to use Micron's 64-layer 3D TLC NAND flash. Looking at the picture above, you can see that there are two 128GB NAND flash packages on either side of the PCB. The drive also has a pair of 256MB NANYA DDR3L memory chips that are used for caching.

The aluminum heatsink included with the SX8200 Pro is simple, yet functional. It attaches to the top of the drive using thermal adhesive and does have a small, yet measurable, impact on temperature. I found that, with the heatsink installed, the SX8200 Pro's temps dropped by a few degrees during idle periods and heavy workloads.