Continuing to lead the way forward for UFS technology, KIOXIA America, Inc. today announced the launch of its Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology. For applications needing high density, such as cutting-edge smartphones, KIOXIA QLC technology enables the capability to achieve the highest densities available in a single package.
The new 512 Gigabyte QLC UFS PoC (Proof of Concept) devices utilize the company’s 1 Terabit BiCS FLASH™ 3D flash memory with QLC technology, for potential larger Terabyte scale QLC UFS density offerings in the future. The new device is designed to meet the increasing performance and density requirements of mobile applications driven by higher resolution images, 5G networks, 4K plus video and the like.
“KIOXIA has been at the forefront of UFS memory since 2013 when we were the first to sample the technology1, and we continue to update our lineup of managed flash solutions that make an improved user experience a reality,” noted Scott Beekman, vice president, Memory Business Unit, for KIOXIA America, Inc. “QLC UFS is another compelling solution to add to this broad lineup.”
KIOXIA is now sampling its 512 Gigabyte QLC UFS PoC devices to OEM customers. For more information, visit www.kioxia.com.