ADATA Releases New MLC IESU317 External SSD And IUFU33B Flash Drive
ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce the ADATA IESU317 external solid state drive (SSD) and the IUFU33B flash drive. Both products are equipped with MLC NAND flash and support the high-speed USB 3.2 interface, which combines excellent durability with next-gen performance. The products are compatible with a wide range of operating systems for plug-and-play usability and provide users a practical, convenient, and reliable mobile storage solution.
ADATA IESU317 SSD - Durable, High-Speed, Large Capacity
The IESU317 external SSD sports a slim form factor of just 9.6mm (0.38in) and a sandblasted metal casing with a matte finish that is not only highly durable but also resistant to scratching and fingerprints. With the next-generation USB 3.2 Gen 1 interface, the SSD delivers read and write speeds of up to 435/400MB per second, for speedy data transfers and back up. Equipped with MLC NAND flash, the IESU317 provides a higher P/E Cycle (Program/Erase Cycle) than its TLC counterparts of up to 3K. This significantly extends data retention and reduces the risk of data corruption or loss. What’s more, the SSD features AES 256-bit encryption for robust data protection and comes with up to 1TB capacity, making it especially suitable for users working in animation, photography, graphic design, or any users that need to encrypt, back up, and store data only a daily basis.

CDRLabs has put together a brief review of ORICO's new transparent NVMe M.2 SSD enclosure. This tool-free design features a clear, plastic case that lets you see the drive inside as well as a finned, aluminum heatsink to keep it cool. ORICO's new enclosure is also equipped with JMicron's JMS583 USB 3.1 Gen 2 to PCIe Gen3 x2 bridge controller which provides Type-C connectivity, 10Gbps data transfer speeds and support for TRIM and UASP.
Toshiba Memory Corporation, the world leader in memory solutions, today announced XFMEXPRESS, a new technology for removable PCIe attached, NVMe memory devices. With a new form factor and an innovative connector, XFMEXPRESS technology delivers an unparalleled combination of features designed to revolutionize ultra-mobile PCs, IoT devices and various embedded applications. Recognizing the need for a new class of removable storage, Toshiba Memory leveraged its extensive background in single package memory designs to develop XFMEXPRESS technology and offer these key features:

