PNY announced today the launch of the X-PRO 90 line of UHS-II SD Flash Memory Cards featuring V90 Video Speed to the company's assortment of full-size SD cards. The new X-PRO 90 line of Flash Memory Cards leverage the latest in Ultra-High-Speed technology, UHS-II. These cards offer the performance needed for professional photographers and enthusiasts alike to capture high quality content seamlessly.

The PNY X-PRO 90 UHS-II SD Flash Memory Cards have been designed to meet the needs of photo and video professionals by harnessing the power of UHS-II. The UHS-II bus holds distinct advantages over its predecessor, UHS-I, and was engineered to support the most demanding applications, with specific emphasis on write intensive applications such as 4K and 8K videography. These SD cards really shine where maximum bit rate and maximum frame rate are necessary to take full advantage of the capabilities of the host.

Designed for Dramatically Accelerated Workflow
UHS-II provides bus speeds of up to double those of UHS-I by employing two rows of pins for data transfer. When operating in Half Duplex mode, the UHS-II bus employs both rows to transfer data in the same direction, allowing the card to achieve transfers of up to 300MB/s sequential read and 280MB/s sequential write! This means that the user can shoot video at incredibly fast speeds. Alternatively, the UHS-II bus can also operate in Full Duplex mode (at half the speed of Half Duplex mode) whereby each row transfers data in the opposite direction at the same time, allowing for the movement of content from the host to the card and vice versa, simultaneously. This allows the user to execute two tasks at once, dramatically accelerating the speed at which they can execute post-production editing activities, translating into incredibly efficient workflows.

Today, Memblaze officially announced the launch of PBlaze6 6530 series PCIe 4.0 enterprise SSD oriented towards the mainstream market after releasing the first PCIe 4.0 PBlaze6 6920 ultimate SSD series in April. Based on the Memblaze self-developed Unified Framework Platform (MUFP), the PBlaze6 6530 series supports NVMe 1.4 specifications and adopts the latest 176-layer enterprise level 3D eTLC NAND flash memory. Compared with its predecessor, the PBlaze6 6530 series features higher endurance, significantly improved performance, with Random Read reaching up to 1100k IOPS. PBlaze6 6530 series supports more enterprise functions and security features, meeting the stringent requirements of hyperscale users in internet, cloud computing, finance and telecommunications etc. filed.

Better performance greatly accelerates applications
PBlaze6 6530 series enterprise SSD supports PCIe 4.0 x 4 interfaces and enjoys superior Read/Write bandwidth. With latest 176-layer enterprise 3D eTLC NAND flash memory and MemSpeed 4.0 technology, it can provide 4K Random Read performance up to 1100k IOPS, 4K Random Write performance exceeding 425K IOPS, and sequential Read/Write bandwidth reaching 6.8GB/s and 4.8GB/s, respectively. Therefore, it can deliver better performance for enterprise users, supporting substantial acceleration in business applications.

KIOXIA America, Inc. today announced the production availability of its EM6 Series Enterprise NVMe-oF™ solid state drives (SSDs) for Ethernet Bunch of Flash (EBOF) systems. Using the Marvell 88SN2400 NVMe-oF SSD converter controller that converts an NVMe® SSD into a dual-ported 25Gb NVMe-oF SSD, KIOXIA EM6 Series drives expose the entire SSD bandwidth to the network.

Due to their ability to scale performance of NVMe SSDs, native NVMe-oF architectures are well-suited for applications such as artificial intelligence (AI)/machine learning (ML), high performance computing (HPC) and storage expansion. In the case of HPC, leveraging the Lustre® file system, which is used to provide high bandwidth and parallel access to compute clusters, is beneficial to NVMe-oF based storage, such as EBOF systems with EM6 SSDs, that enable high availability (HA) configurations. An HPC HA configuration example consists of multiple and redundant network connections between a compute host and an EBOF with 88SN2400-connected NVMe SSDs, to deliver scalable throughput based on the number of SSDs.

In an HA disaggregated block storage expansion use case, the same configuration could accommodate multiple host systems, providing shared and scalable block storage with high bandwidth utilization of the NVMe SSDs.

KIOXIA EM6 Series drives have successfully undergone NVIDIA® GPUDirect Storage® (GDS) certification testing. GDS connects to NVIDIA A100-based systems to accelerate AI/ML applications, and EBOF storage platforms enable scaling of NVMe flash storage for these storage-hungry workloads.

OWC, the premier zero-emissions Mac and PC technology company, and a respected provider of Memory, External Drives, SSDs, Mac & PC Docking Solutions, Network Attached Storage, and Performance Upgrade Kits, today announces the all-new OWC Accelsior 8M2. The OWC Accelsior 8M2 brings impressive speed and storage capacity to 2019 Mac Pros, Windows or Linux computers, and PCIe expansion systems. It utilizes the total bandwidth of the latest PCIe technology and has a highly efficient heat dissipating design to provide ultra-reliable speeds up to 26,000MB/s. Creating the fastest PCIe SSD meant combining bold engineering with the latest technology. Each OWC Accelsior 8M2's eight NVMe M.2 SSD slots can run at their full x4 lanes of data throughput. All that insanely fast speed through an entire PCIe 4.0 x16 lane architecture with up to 64TB of storage.

The OWC Accelsior 8M2 offers total performance gains in so many diverse ways that it lets you create without limits:

• Edit and playback 16 streams of 8K ProRes444 without a glitch
• Keep page scenery and textures looking sharp and flowing uninterruptedly in virtual reality environments
• Experiment with larger formats and be closer to final work
• Ensure augmented reality visualizations look life-like
• Edit and store massive photo images and graphics files
• Experience faster previews, renders, and processing in VFX programs
• Effortlessly store and work with multiple production libraries and applications
• Run more iterations in DevOps in less time
• Quickly offload essential data to cloud archives for more advanced IoT management

KLEVV, an emerging memory brand introduced by Essencore, today announced the latest addition to its lineup of computer memory upgrades with new DDR5 memory series, including DDR5 standard memory and signature DDR5 series of overclocking/gaming RGB memory. KLEVV DDR5 memory offers assurance of QVL testing with major motherboard brands’ Z690 platforms that support the latest Intel 12th Generation ‘Alder Lake’ Core Processors.

KLEVV DDR5 Overclocking/Gaming RGB Memory Series: New Color and Extreme Speeds of up to 6,400MHz
Arriving 2022, KLEVV DDR5 overclocking/gaming memory series continues the outstanding and unique design of current CRAS XR RGB, with the addition of a brand new white color tone to its RGB lighting effects; ideal for enthusiasts looking to bring a spark of speed and intense color into their gaming builds. KLEVV DDR5 overclocking/gaming memory series will feature extreme speeds of up to 6,400MHz. Exact specifications will be announced at the time of launch.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has developed the industry’s first 14-nanometer (nm) based 16-gigabit (Gb) Low Power Double Data Rate 5X (LPDDR5X) DRAM, designed to drive further growth throughout the high-speed data service applications including 5G, artificial intelligence (AI) and the metaverse.

“In recent years, hyperconnected market segments such as AI, augmented reality (AR) and the metaverse, which rely on extremely fast large-scale data processing, have been rapidly expanding,” said SangJoon Hwang, senior vice president and head of the DRAM Design Team at Samsung Electronics. “Our LPDDR5X will broaden the use of high-performance, low-power memory beyond smartphones and bring new capabilities to AI-based edge applications like servers and even automobiles.”

A new era for flash used in servers and storage is here, and it’s being introduced by KIOXIA America, Inc. Today, the company announced the industry’s first lineup of Enterprise and Datacenter Standard Form Factor (EDSFF) E3.S SSDs designed with PCIe 5.0 technology – the CD7 Series. Building on the KIOXIA E3.S full-function development vehicle that received a ‘Best in Show’ award at last year’s Flash Memory Summit, the CD7 Series E3.S increases flash storage density per drive for optimized power efficiency and rack consolidation.

Breaking free from the design limitations of the 2.5-inch form factor, the EDSFF E3 family is optimized for the needs of high-performance, highly efficient servers and storage. EDSFF enables the next generation of SSDs to address future data center architectures, while supporting a variety of new devices and applications. It provides improved airflow and thermals, signal integrity benefits, and options for larger SSD capacity points. EDSFF standardizes status LEDs on the drive, which eliminates the need for LEDs on the drive carriers. Support for higher E3.S power budgets than 2.5-inch form factor SSDs and better signal integrity allows EDSFF to deliver the performance promised by PCIe 5.0 technology and beyond.

Based on KIOXIA’s innovative fourth generation BiCS FLASH™ 3D flash memory technology, the CD7 Series supports x4 PCIe lanes, but is optimized for PCIe Gen5x2 performance, which is similar to PCIe Gen4x4 performance, saving two valuable PCIe lanes for additional device connections. KIOXIA is an active and contributing member to the industry development of EDSFF solutions, and is collaborating with leading server and storage system developers to unlock the full power of flash memory, NVMe® and PCIe technologies.