As technology innovation accelerates both data creation and value, the need for scalable, efficient, high-performance storage solutions has never been greater. Today, Seagate Technology announced its next-generation Mozaic™ 4+ platform, the industry’s only heat-assisted magnetic recording (HAMR)–based storage platform deployed at-scale, is now qualified and in production with two leading hyperscale cloud providers. Supporting capacities up to 44TB, these qualifications reflect production-scale deployments in hyperscale environments.

With additional customer qualifications under way, Seagate is delivering on its roadmap to scale from today’s 4+TB per-disk toward a future 10TB per-disk – enabling hard drive capacities of up to 100TB. The platform incorporates a next-generation suspension architecture and an enhanced system-on-a-chip that enables precise recording at higher densities while maintaining enterprise-class reliability. Each platform generation allows continued gains in capacity without requiring disruptive architectural shifts.

"Data has become one of the most valuable assets for enterprises, fueling business insights, enhancing productivity, and enabling competitive advantage. As the foundation of modern data center infrastructure, data storage solutions are essential to manage ever-increasing data volumes and maximize returns on investments in today’s AI driven-world," said Dave Mosley, Seagate’s chair and chief executive officer. "Seagate’s HAMR-based Mozaic products deliver the scale, performance, and efficiency customers need to unlock the full potential of their data."

Micron Technology, Inc. today extended its leadership in low-power server memory by shipping customer samples of the industry’s highest-capacity LPDRAM module — 256GB SOCAMM2. Enabled by the industry’s first monolithic 32Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures.

The convergence of AI training, inference, agentic AI and general-purpose compute are driving more demanding memory requirements and reshaping data center system architectures. Modern AI workloads drive large model parameters, expansive context windows and persistent key value (KV) caches, while core compute continues to scale in data intensity, concurrency and memory footprint.

Sandisk today announced the next generation of its portable SSD portfolio, introducing a three-tier lineup designed to support larger file sizes, AI content, and the increasingly demanding digital workflows of everyday users, creators, and professionals. The portfolio includes the SANDISK Portable SSD, SANDISK Extreme Portable SSD, and SANDISK Extreme PRO Portable SSD. Delivering nearly twice the speed of its predecessor and enhanced durability, the SANDISK Extreme Portable SSD is available today, with the full portfolio of products rolling out later this year.

“Whether at home, in the office, or on the go, this new generation of portable SSDs support customers across their storage needs,” said Heidi Arkinstall, Vice President of Consumer Marketing at Sandisk. “From everyday users, to creative enthusiasts, to production professionals, the SANDISK portable SSD portfolio balances performance, portability, and durability to give people storage they can depend on as their needs evolve.”

KIOXIA America, Inc. today announced that it has begun shipping evaluation samples of embedded flash memory compatible with the next-generation UFS standard, UFS 5.0, which is currently being standardized by JEDEC.

UFS 5.0 is a new standard for embedded flash storage designed to meet the performance requirements of next-generation mobile devices such as high-end smartphones equipped with on-device AI functions. It utilizes MIPI® M-PHY® version 6.0 for the physical layer and UniPro® version 3.0 for the protocol. M-PHY version 6.0 introduces the new HS-GEAR6 mode, theoretically supporting an interface speed of up to 46.6 Gigabits per second (Gb/s) per lane; with 2 lanes, UFS 5.0 can achieve approximately 10.8 Gigabytes per second (GB/s) of effective read/write performance.

The evaluation samples incorporate a newly developed in-house controller for UFS 5.0 and KIOXIA BiCS FLASH™ generation 8 3D flash memory and support capacities of 512 GB and 1 TB. The package has been redesigned with a small 7.5 x 13 mm size, contributing to board space efficiency and design flexibility.

BIOSTAR, a leading manufacturer of edge computing solutions, industrial motherboards, graphics cards, storage devices, and memory solutions, is excited to introduce its latest DDR5 16GB UDIMM memory, available in 4800MHz and 5600MHz variants. Designed with a focus on stability, efficiency, and broad system compatibility, the new DDR5 memory delivers reliable performance across everyday computing and professional applications.

Designed to support a wide range of computing environments, BIOSTAR DDR5 16GB UDIMM memory offers a balanced and dependable solution for everyday and professional use. From home entertainment and office productivity to HTPC systems, NAS deployments, system integration projects, content creation, and casual to mid-range gaming, this memory delivers smooth multitasking and consistent system responsiveness across diverse workloads.

Kioxia Singapore Pte Ltd, a worldwide leader in memory solutions, today announced the EXCERIA PRO G2 SDXC UHS-II Memory Card Series, designed for 8K video recording and continuous shooting. This series features two models in the Video Speed Class: V90 and V60. The V90 is a model designed for professionals seeking performance in 8K video recording, while the V60 is a more economical model with a good balance between speed and cost for those looking for UHS-II performance.

The all-new EXCERIA PRO G2 SDXC UHS-II Memory Card V90 takes professional photography, filmmaking, and content creation to the next level. Designed for 8K video recording and continuous shooting, these cards provide seamless performance and ample storage space with capacities up to 512GB and reads up to 310MB/s and writes up to 300MB/s for high-end 8K photo or video shoots. With their UHS-II rating, this series enhances workflows with faster file transfers and smoother editing.

KIOXIA America, Inc. today announced that it has begun sampling new Universal Flash Storage (UFS) Ver. 4.1 embedded memory devices with 4-bit-per-cell, quadruple-level cell (QLC) technology. Designed for read-intensive applications and high-capacity storage needs, the new devices are powered by KIOXIA’s 8th generation BiCS FLASHTM 3D flash memory technology.

QLC UFS offers a higher bit density than traditional TLC UFS, making it suitable for mobile applications that require higher storage capacities. Advancements in controller technology and error correction have enabled QLC technology to achieve this while maintaining competitive performance.

Building on these advancements, the new Kioxia devices achieve substantial performance increases. KIOXIA’s QLC UFS boosts sequential write speeds by 25%, random read speeds by 90%, and random write speeds by 95% compared to the previous generation (UFS 4.0/BiCS6 QLC UFS). Write Amplification Factor (WAF) is also improved by up to 3.5x (with WriteBooster disabled).