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Today, Star Wars fans can choose to represent their side of the Force with the new collectible Seagate Solid State Drives (SSD) inspired by iconic characters of the Star Wars galaxy. Featuring interchangeable faceplate designs honoring Obi-Wan Kenobi, Darth Vader, and Luke Skywalker, the latest additions to the company’s line of licensed special edition storage devices bring PCIe Gen4 speeds, peak performance, and customization to the battle stations of Star Wars collectors and tech enthusiasts.
Officially licensed by Lucasfilm, the special edition FireCuda™ NVMe SSD represents the famed characters with three iconic LightsaberTM designs built on swappable heatsink faceplates so gamers can choose a design inspired by the Jedi or Sith that fits their collection at any moment. The drive includes customizable RGB LED lighting1 that shines through the faceplate to bring a galaxy of atmosphere to battle stations. The unique loading mechanism that attaches the interchangeable faceplates to the SSD and the heatsink were engineered and developed by EKWB. The integrated passive heatsink minimizes thermal throttling and maintains peak performance for longer periods of time.
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Demonstrating continued innovation, Kioxia Corporation and Western Digital Corp. today announced details of their newest 3D flash memory technology. Applying advanced scaling and wafer bonding technologies, the 3D flash memory delivers exceptional capacity, performance and reliability at a compelling cost, which makes it ideal for meeting the needs of exponential data growth across a broad range of market segments.
“The new 3D flash memory demonstrates the benefits of our strong partnership with Kioxia and our combined innovation leadership,” said Alper Ilkbahar, Senior Vice President of Technology & Strategy at Western Digital. “By working with one common R&D roadmap and continued investment in R&D, we have been able to productize this fundamental technology ahead of schedule and deliver high-performance, capital-efficient solutions.”
Kioxia and Western Digital reduced the cost by introducing several unique processes and architectures, enabling continued lateral scaling advancements. This balance between vertical and lateral scaling produces greater capacity in a smaller die with fewer layers at an optimized cost. The companies also developed groundbreaking CBA (CMOS directly Bonded to Array) technology, wherein each CMOS wafer and cell array wafer are manufactured separately in its optimized condition and then bonded together to deliver enhanced bit density and fast NAND I/O speed.
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No more to traditional mechanical drivesas the era of high-capacity QLC has arrived. Leading memory brand TEAMGROUP today has announced the launch of two QLC SSDs to meet the various needs of users: TEAMGROUP MP33Q M.2 PCIe SSD and T-FORCE VULCAN Z QLC SSD come in capacities of up to 2TB and 4TB, respectively. Whether for more storage for installing or storing OSs, programs, games, or documents, they are the perfect upgrade solutions for your computer.
In response to different storage upgrade needs of consumers, TEAMGROUP MP33Q M.2 PCIe SSD is designed with 3D QLC flash memory chips, PCIe Gen3x4 interface and NVMe 1.3 protocol. With up to 2,500MB/s in read speed and 2,100MB/s in write speed, it outperforms SATA III SSDs by five times and is available in capacities of up to 2TB. With its carefully selected 3D QLC NAND flash and SLC Cache technology, TEAMGROUP MP33Q M.2 PCIe SSD brings a top-of-the-line solution to the storage market.
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SMART Modular Technologies, Inc. (“SMART”), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products announces the introduction of its new T6CN family of PCIe NVMe SSD products which is part of the SMART RUGGED portfolio.
T6CN SSDs are designed to fit between very high-performance datacenter SSDs and highly secure, ruggedized SSDs for military, industrial, and telecom applications. Competitively priced, the T6CN is available in M.2 2280, E1.S and U.2 form factors. All of which provide compatibility with PCIe Gen 4.0 NVME technology, delivering faster read, write, data transfer and operating speeds compared to current SSD technology.
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MSI, the world's leading gaming PC hardware brand, is announcing the launch of the next-gen model to its SSD product line - SPATIUM M570 PCIe 5.0 NVMe M.2 HS. With the same gamers’ first attitude that has made MSI products great, MSI continues pushing the limits to unleash next-level storage performance with the latest PCIe Gen 5 controller technology and state-of-the-art 3D NAND flash, providing up to 1.5 times faster read/write speeds compared to the previous generation SSDs. On SPATIUM M570, the aluminum bronze-colored heatsink improves heat dissipation to sustain transfer speeds for professionals, content creators, and gamers to gain valuable milliseconds on latency or to process gigabytes of files. Other performance-improving technologies include DRAM cache buffer and an SLC cache.
SPATIUM M570 HS, the First Gen 5 Model Supercharging the MSI SSD Lineup.
The SPATIUM M570 HS is powered by the latest PCIe Gen 5 controller technology with high-quality 3D NAND flash, and advanced cooling takes a sensational leap in storage performance, unleashing the latest in extreme transfer rates of up to 10,000 MB/s sequential read & write speeds for demanding professionals, content creators, and gamers in an easy installation. Sporting a bronze-colored aluminum heatsink, the stacked fin structure efficiently dissipates heat from the M570, and sustains maximum throughput under heavy workloads. With compliance of NVMe 2.0 and M.2 2280 form factor, the SPATIUM M570 HS offers optimal performance and long-lasting durability in 1TB and 2TB capacity variants. The SPATIUM M570 HS supports a comprehensive range of data error correction features including LPDC ECC and E2E Data Protection, providing a high-rated TBW (Terabytes Written) for excellent durability and longevity backed with a limited 5-year warranty.
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Lexar, a leading global brand of flash memory solutions, is excited to announce the 512GB addition to the Lexar CFexpress Type-B Card DIAMOND Series lineup. This expanded capacity allows photographers and videographers even more freedom when shooting on location or in studio.
The card also delivers on performance with transfer speeds of up to 1900MB/s, write speeds up to 1700MB/s and a minimum write speed of 1600MB/s. It is rated VPG400 and features PCIe Gen 3x2 and NVMe protocols for smooth, high-speed recording of images and 8K video.
“The CFexpress™ Type-B Card DIAMOND Series delivers on what professional photographers and videographers demand—the performance and capacity to not only empower creativity, but to accelerate workflows to keep pace with the professional’s hectic schedule,” said Joey Lopez, Director, Brand Marketing.
Compatible with firmware-enabled CFexpress cameras, the CFexpress™ Type-B Card DIAMOND Series is now available in 512GB, 256GB, and 128GB capacities.
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Silicon Power releases the new Superior Pro SDXC UHS-II card for professional content creators in every niche. It’s compatible with all of the latest devices including DSLR cameras, drones, and cinema-quality video recorders.
Express Your Creativity With Cutting-Edge Memory
Complement high-end devices and capture superior content with the advanced UHS-II interface and V60 Video Speed Class. Use it for 3D or 360° photography. Record uninterrupted, cinema-grade videos in 4K Ultra HD resolution. Or, shoot continuous high-quality JPEG and RAW images with no lag.
Reliable Recording Performance With V60
With a Video Speed Class 60 (V60) rating, you'll get minimum sustained write speeds of 60MB/s. This eliminates the risk of sudden decreases in performance that would otherwise cause dropped frames, bits of compromised video quality, and other issues.
Capture Everything With Incredible Speeds
UHS-II technology empowers this card to reach incredibly fast speeds. Accelerate your workflow from start to finish in a snap with read speeds up to 280MB/s. Tackle burst-mode photography with ease or record smooth and uninterrupted videos with write speeds up to 170MB/s.
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With the releases of the latest generation of Intel and AMD platforms, the era of PCIe 5.0 SSD has officially arrived. TEAMGROUP today has launched the T-FORCE CARDEA Z540 M.2 PCIe 5.0 SSD. Developed with outstanding technological expertise, it is the SSD gamers of all kinds have been waiting for. Now it's ready to lead the consumer SSD market into the new era of Gen5. The Z540 PCIe 5.0 SSD uses the latest PCIe Gen 5 x 4 interface and supports the latest NVMe 2.0 protocol, allowing it to reach read and write speeds of up to 12,000MB/s and 10,000MB/s respectively, nearly double the theoretical speed limit of PCIe 4.0. Possessing cutting-edge specifications, Z540 SSD brings gamers an unprecedented, next-generation gaming experience.
The T-FORCE CARDEA Z540 M.2 PCIe 5.0 SSD is equipped with an exclusive ultra-thin graphene heat spreader that combines multiple patented technologies. It's made of 100% recyclable graphene material and utilizes the advantages of hexagonal honeycomb lattice structures to rapidly and evenly disperse heat horizontally, providing Z540 SSD with top-notch cooling. The Z540's ultra-thin graphene heat spreader is less than 1mm thick and is compatible with various PCIe 5.0 motherboard heatsinks. Based on T-FORCE LAB's internal testing, the operating temperature of Z540 SSD combining motherboard heatsink and graphene heat spreader is 3–5°C lower than the temperature with only motherboard heatsinks. Moreover, CARDEA Z540 uses the latest intelligent thermal regulation technology with built-in temperature sensing to automatically adjust performance and prevent overheating. T-FORCE LAB has created numerous temperature solutions for the Z540 SSD to not only enhance and protect data integrity of the SSD but also maintain good operating temperatures at high speeds, extending the lifespan of the SSD.
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Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers for solid-state storage devices, today announced the SM2268XT, its latest high-performance PCIe Gen4 SSD controller solution optimized for higher speed NAND transfer rates. The SM2268XT's superior performance and robust reliability allows customers to accelerate development of next-generation SSDs using current and future TLC and QLC 3D NAND flash with comprehensive data integrity and correction without compromising throughput and latency.
The SM2268XT features a dual-core ARM R8 CPU with four lanes of 16Gb/s PCIe data flow and supports four NAND channels with up to 3,200 MT/s per channel, enabling designers to take advantage of higher throughput next-generation high-speed TLC and QLC 3D NAND flash. Its multi-core design automatically balances the compute load to deliver industry-leading sequential read and write speeds of 7,400 MB/s & 6,500 MB/s, and random read & write speed of 1,200K IOPS. In addition, its advanced architecture enables lower power consumption and rigorous data protection, providing high performance and reliability in a cost-effective DRAM-less PCIe Gen4 NVMe SSD solution.
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Lexar, a leading global brand of flash memory solutions, is excited to announce the new Lexar JumpDrive M900 USB 3.1 Flash Drive. This stylish and durable metal drive is perfect for on-the-go business professionals and students.
The drive features a stylish metal design that is not only sleek but offers the rugged durability that users need to keep their files handy no matter where they are.
The Lexar JumpDrive M900 USB3.1 Flash Drive delivers on performance too. With read speeds up to 400MB/s1, busy professionals can save time and transfer files fast so they can quickly move onto the next project.
“We know that users are looking for both security and efficiency–and this drive offers both. Our DataShield software makes it easy to secure important files and USB 3.1 performance means less downtime waiting for files to transfer,” said Joey Lopez, Director of Brand Marketing.
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