QNAP Systems, Inc. today announced the release of the dual-core 2-bay TS-251A and the 4-bay TS-451A. These models feature a unique USB QuickAccess port to directly connect them to computers via USB 3.0, offering great plug-and-use convenience to access files stored on the NAS with up to 100 MB/s throughput. Coupled with NAS and iSCSI SAN features, it provides a complete storage solution for file backup, synchronization, and remote access. With two Gigabit LAN ports for delivering up to 211 MB/s throughput, 4K video playback and transcoding support, and an array of multimedia applications, the TS-x51A is an ideal NAS system for photographers and audiovisual enthusiasts.
The TS-x51A is powered by the latest 14nm Intel® Celeron® dual-core 1.6GHz processor (burst up to 2.48 GHz) with a low TDP of 6 watts and dual-channel 2GB/4GB DDR3L-1600 RAM (upgradable to 8GB). It features two Gigabit Ethernet ports and supports AES-NI hardware-accelerated encryption to deliver up to 205.14 MB/s throughput with AES-NI full-volume encryption. “The USB QuickAccess port is the true highlight of the TS-x51A. It enables a direct connection between the NAS and a Windows®/ Mac® for file transferring,” said Jason Hsu, Product Manager of QNAP, adding “It provides users with a familiar USB plug-and-use experience to quickly complete the first-time installation and then to access NAS files in day-to-day use. It is an easy-to-use NAS packed with performance and functionality.”Add a comment
VIA Technologies, Inc, today announced that it be will demonstrating its latest VIA NVMe PCIe Gen III & SATA III SSD controllers in Booth#818 of the 2016 Flash Memory Summit being held from August 9th to 11th in the Santa Clara Convention Center, California, USA.
Featuring the VIA LDPC PLUS ECC decoding engine with Gear-Shifting technology, the second generation VIA SSD controllers offer best-in-class error correction capability and ensure high-throughput performance without overheating issues.
“VIA Gear-Shifting technology leverages our unique dual hardware decoding architecture to maximize data integrity and longevity,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “Our second generation VIA SSD controllers are the ideal choice for computing devices that require superior SSD performance with high cost-efficiency.”Add a comment
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced a blueprint for next-generation flash memory solutions that will meet the ever-increasing demands of big data networks, cloud computing and real-time analysis.
At Flash Memory Summit 2016, held in the Santa Clara (CA) Convention Center, Samsung showcased its 4th generation Vertical NAND (V-NAND) and a line-up of high-performance, high-capacity solid state drives (SSDs) available for its enterprise customers as well as Z-SSD, a new solution providing breakthrough performance for flash-based storage.
Samsung’s new flash storage devices are expected to contribute significantly to the global IT industry in meeting the growing storage requirements of today’s enterprise computing environment. These solutions will accommodate enormous amounts of data, and extremely high-speed information processing, while enhancing the total cost of ownership (TCO) for data centers.Add a comment
Marvell, a world leader in storage, cloud infrastructure, Internet of Things (IoT), connectivity and multimedia semiconductor solutions, today announced the expansion of its solid-state drive (SSD) portfolio to include the 88NV1160 Non-Volatile Memory (NVM) Express DRAM-less SSD controller. Marvell’s 88NV1160 DRAM-less SSD controller provides the industry’s leading performance per Watt and up to 1600MB/s read speeds. The 88NV1160 can be used in a single ball grid array (BGA) package SSD, as well as in a standalone controller in a tiny 9x10mm package which makes it compatible with M.2230 and M.2242 form factors. These features make the 88NV1160 optimized for a new generation of slim computing devices such as productivity tablets and ultrabooks. The new controller is currently available for sampling to key customers globally.
“As the world’s leading storage controller provider, Marvell has a long track record of bringing to market world-class innovations, including the pioneering integration of Host Memory Buffer technology into DRAM-less products. Working closely with other ecosystem leaders, Marvell has continued to advance the industry and drive a new generation of low power, small form factor mobile computing systems,” said Dr. David Chen, Vice President of SSD Business at Marvell Semiconductor, Inc. “The 88NV1160 controller is optimally engineered for high performance tablets and ultrabooks, providing unparalleled performance per Watt and the largest NAND compatibility on the market.”Add a comment
Micron Technology, Inc., today introduced the company's first 3D NAND memory technology optimized for mobile devices and its first products based on the Universal Flash Storage (UFS) 2.1 standard. Micron's initial mobile 3D NAND-based 32GB solution is targeted specifically for the high and mid-end smartphone segments which make up approximately 50 percent of worldwide smartphone volume. As mobile devices bypass personal computers as consumers' primary computing device, user behaviors heavily impact the device's mobile memory and storage requirements. Micron's mobile 3D NAND addresses these concerns, enabling an unparalleled user experience that includes seamless high definition video streaming, higher bandwidth gameplay, faster boot up times, camera performance and file loading.
"Micron continues to advance NAND technology with our introduction of 3D NAND and UFS products for the mobile segment," said Mike Rayfield, vice president of Micron's mobile business unit. "The improved performance, higher capacity and enhanced reliability of 3D NAND will help our customers meet the ever-growing demand for mobile storage and will enable much more exciting end user experiences."
To meet the elevated hardware demands stemming from increased mobile video and multimedia consumption, as well as the anticipated increased storage demands that will result from the introduction of 5G wireless networks, Micron 3D NAND technology stacks layers of data storage cells vertically with extraordinary precision to create storage solutions with three times more capacity than previous generation planar NAND technologies. Because capacity is achieved by stacking cells vertically, Micron is able to pack more storage cells into a much smaller die area, resulting in the delivery of the industry's smallest 3D NAND memory die measuring only 60.217mm2. A smaller die enables a tiny memory packaging footprint which can free up space for additional mobile battery size or enable smaller form factor devices.Add a comment
Seagate Technology plc announced today at the Flash Memory Summit conference two new flash innovations that extend the limits of storage computing performance in enterprise data centers to unprecedented levels. The new products include a 60 terabyte (TB) Serial Attached SCSI (SAS) solid-state-drive (SSD) — the largest SSD ever demonstrated — and the 8TB Nytro XP7200 NVMe SSD. These two new products represent the high performance end of Seagate’s Enterprise portfolio – a complete ecosystem of HDD, SSD and storage system products designed to help customers manage the deluge of data they face and move the right data where it’s needed fast to meet rapidly evolving business priorities and market demands.
The 60TB SAS SSD and 8TB Nytro XP7200 NVMe SSD are the newest additions to Seagate’s data center portfolio and are designed to help enterprise IT leaders obtain more value from the rapidly expanding amount of data they must contend with, even under the most demanding application requirements. The 60TB SAS SSD features twice the density and four times the capacity of the next highest-capacity SSD available today — equivalent to the capacity needed to accommodate 400 million photos on a typical social media platform, or 12,000 DVD movies. This single controller architecture also delivers the lowest cost per gigabyte for flash available today.Add a comment
Lite-On Storage, a rising player in the rapidly expanding solid-state drive (SSD) industry, will showcase its latest enterprise, industrial, client, and consumer storage solutions at this year’s Flash Memory Summit in Santa Clara, CA (Aug. 9-11).
Lite-On Storage will use the annual event to shine a bright light on four key solutions: its next generation Enterprise EP3 Series, a M.2 NVMe PCIe drive and the latest EP2 NVMe U.2 Series, its Client CA1 Series using high-performance TLC NAND, and its consumer brand, Plextor® M8Pe Series SSDs for the extreme gamers and DIY. Lite-On Storage will also demo its exciting new storage architecture in Open Channel SSD, the AD2 Series.
The popularity of these solutions with enterprise organizations is a major reason Lite-On becomes top-three worldwide supplier in the SSD industry. Lite-On Storage solid state solutions are becoming known for offering fast and consistent performance, end-to-end data power loss protection, incredibly high endurance and robust firmware.Add a comment
Seagate Technology plc, a world leader in storage solutions, today announced the release of the Nytro XF1230 SATA solid-state drive (SSD), an energy-efficient drive specifically designed to meet the performance and reliability requirements of today’s cloud data centers.
The Nytro XF1230 SATA SSD features a 6 gigabyte-per-second interface, making it easy to deploy in existing storage infrastructures. Optimized for read-centric databases and workloads, it provides random access performance as high as 98,000 input/output operations per second (IOPS), equivalent to the performance of 200 hard disk drives, but for a fraction of the power and cost. Additionally, the drive offers enterprise-class reliability, with the level of protection needed in today’s cloud environments, including a power loss data protection circuit to prevent data loss in the event of a power disruption.
“SSDs in enterprise data centers provide extremely fast data access in a small footprint, while consuming very little energy. No SSD in its class does this better than Seagate’s latest addition to the Nytro product line,” said Brett Pemble, Seagate’s general manager and vice president of SSD products. “This is a critical addition to our growing SSD portfolio and an answer to what our enterprise customers have been asking for: a highly reliable, very low-latency SATA SSD that’s also energy efficient. It also means more people get more value from more data for lower cost.”Add a comment
Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, will showcase its new BG series solid state drive (SSD) family featuring cutting-edge BiCS FLASH with 3-bit-per-cell TLC (triple-level cell) technology and Toshiba’s new single-package ball grid array (BGA) NVMe PCI Express (PCIe) Gen3 x2 SSD at the 2016 Flash Memory Summit held in Santa Clara, California between August 8 - 11. Delivering a smaller footprint3, lower power consumption4 and better performance5 than traditional storage options, the BG SSD series is purpose-built for the future wave of ultra-thin mobile PCs, including 2-in-1 convertible notebooks and tablets.
With a surface area 95 percent smaller than conventional 2.5-inch SATA storage devices and 82 percent smaller than M.2 Type 22806, the Toshiba BG series condenses both the controller and NAND flash memory in a single 16mm x 20mm BGA package enabling device manufacturers to prioritize features like battery capacity for longer operating times. The BG series is also available mounted on a M.2 Type 22307 module for applications requiring socketed storage. BG SSDs utilize BiCS FLASH, a three-dimensional (3D) stacked cell structure8, making it possible to accommodate up to 512GB of storage capacity in this high-performance and compact form factor. Additionally, the BG series SSDs utilize an in-house Toshiba-developed controller and firmware for a full, vertically developed solution, ensuring technology is tightly integrated for optimal performance, power consumption and reliability.Add a comment
Western Digital Corporation, a world leader in storage solutions, today announced a new, high-capacity configuration of up to 10TB for its award-winning WD Gold datacenter hard drives. Designed for modern enterprise storage systems, WD Gold 10TB datacenter hard drives feature HelioSeal helium-technology for high capacity, power efficient storage for datacenter environments.
WD Gold datacenter hard drives are designed for a broad range of applications – including small- to medium-scale enterprise servers and storage, and rack-mount datacenter servers and storage enclosures. WD Gold 10TB datacenter hard drives feature an optimized design over the existing WD Gold 8TB drives that helps reduce TCO (Total Cost of Ownership) of servers and storage systems through an 8 percent operating power reduction while delivering 25 percent more capacity. This benefits IT administrators challenged with keeping up with growing storage demands on limited budgets.
"It is Western Digital's on-going goal to provide superior reliability and compelling value to the our enterprise customers," said Brendan Collins, vice president of product marketing, Western Digital. "WD Gold drives are a key component of the overall WD portfolio, providing power efficient, capacity-optimized storage for a wide range of high workload applications. The new 10TB capacity enables customers to efficiently deploy higher density storage solutions."Add a comment