Silicon Power, a leading provider of memory storage solutions, adds another brilliant coup of storage convenience to its OTG flash drive portfolio – the new Mobile C50.
As all good things come in threes, SP’s new OTG Mobile C50 has three connectors –USB Type-A, Micro-B, and Type-C. Never lost for the right connection, it’s easier than ever to share data between new-generation USB Type-C devices, any “traditional” USB PC or laptop, and Micro-B smartphones or tablets. The compact drive is also a reliable companion for extra storage needs plug-n-play and tops up USB Type-C or Micro-B mobile devices with up to 128GB free space.Add a comment
The USB 3.0 Promoter Group today announced the pending release of the USB 3.2 specification, an incremental update that defines multi-lane operation for new USB 3.2 hosts and devices. USB Developer Days 2017 will include detailed technical training covering USB 3.2, fast charging advancements in USB Power Delivery, and other exciting topics.
While USB hosts and devices were originally designed as single-lane solutions, USB Type-C™ cables were designed to support multi-lane operation to ensure a path for scalable performance. New USB 3.2 hosts and devices can now be designed as multi-lane solutions, allowing for up to two lanes of 5 Gbps or two lanes of 10 Gbps operation. This enables platform developers to continue advancing USB products to fit their customers’ needs by effectively doubling the performance across existing cables. For example, a USB 3.2 host connected to a USB 3.2 storage device will now be capable of realizing over 2 GB/sec data transfer performance over an existing USB Type-C™ cable that is certified for SuperSpeed USB 10 Gbps.
“When we introduced USB Type-C to the market, we intended to assure that USB Type-C cables and connectors certified for SuperSpeed USB or SuperSpeed USB 10 Gbps would, as produced, support higher performance USB as newer generations of USB 3.0 were developed,” said Brad Saunders, USB 3.0 Promoter Group Chairman. “The USB 3.2 update delivers the next level of performance.”Add a comment
Western Digital Corp. today announced its successful development of four bits per cell, X4, flash memory architecture offering on 64-layer 3D NAND, BiCS3, technology. Building on its pioneering innovation of X4 for 2D NAND technology and past success in commercializing it, the company has now developed X4 for 3D NAND by leveraging its deep vertical integration capabilities. These include silicon wafer processing, device engineering to provide sixteen distinct data levels in every storage node, and system expertise for overall flash management. BiCS3 X4 technology delivers an industry-leading storage capacity of 768 gigabits on a single chip, a 50 percent increase from the prior 512 gigabit chip that was enabled with the three bits per cell (X3) architecture. Western Digital will showcase removable products and solid-state drives built with BiCS3 X4 and systems capabilities in August at the Flash Memory Summit in Santa Clara, California.
“The implementation of X4 architecture on BiCS3 is a significant development for Western Digital as it demonstrates our continued leadership in NAND flash technology, and it also enables us to offer an expanded choice of storage solutions for our customers,” said Dr. Siva Sivaram, executive vice president, Memory Technology, Western Digital. “The most striking aspect in today’s announcement is the use of innovative techniques in the X4 architecture that allows our BiCS3 X4 to deliver performance attributes comparable to those in BiCS3 X3. The narrowing of the performance gap between the X4 and X3 architectures is an important and differentiating capability for us, and it should help drive broader market acceptance of X4 technology over the next several years.”Add a comment
Introducing ROXIO Toast 16 Titanium and Toast 16 Pro, the latest versions of Roxio's powerful digital media and disc burning software for Mac. Toast now includes the new MultiCam Capture making it simple to capture synced footage from your screen, webcam, and supported cameras to help you create engaging video tutorials and presentations. Whether you're making videos for business or fun, Toast 16 with MultiCam Capture is the perfect companion to video editing software like iMovie and Final Cut Pro.
MultiCam Capture in Toast 16 captures all your footage simultaneously, even audio from a high-quality microphone, so there's no post-capture syncing required. Use MultiCam Capture to quickly capture great-looking video footage from multiple angles and your screen. Then import your synced footage into your favorite video editing software to create your final production. With multiple angles recorded, you can explore a variety of creative options, including picture-in-picture effects or switching between camera angles to add interest and draw in viewers.
"With new MultiCam Capture, Toast 16 offers an incredibly powerful video capture and screen recording application. By recording and syncing footage on the fly, you can now easily engage with your audience from any angle. Whether you're creating software training, unboxing videos, or cooking demos, it's never been simpler to capture dynamic content to grab your audience's attention," said Michel Yavercovski, Senior Director of Product Management for Roxio. "Longtime video makers and aspiring YouTube vloggers alike will find MultiCam Capture to be a powerful addition to their video editing toolkit."Add a comment
ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, today launched industrial-grade ISSS314 solid state drives in 3D MLC and 3D TLC versions. All models can withstand a wide temperature range, extreme shocks and vibrations, as well as humidity to meet the needs of industrial users. Using hardened and carefully sorted components, ISSS314 SSDs consume just 2.5W to lower operating costs while providing speedy 560MB/s read and 520MB/s write. They are offered in 3D MLC and 3D TLC NAND plus capacities ranging from 32GB to 512GB in order to better cover and serve as many budgets and needs as possible.
Benefits of 3D NAND for industrial users
The increased durability and power efficiency of stacked NAND Flash compared to older planar NAND offers very appealing advantages in applications that require non-stop and long term use. The ISSS314 range has an MTBF of 2 million hours, which is 25% more than comparable 2D NAND drives. At the same time, they consume just 2.5W per drive while reaching 512GB in capacity. Modest power draw translates into major electricity savings over the life of the drive, especially in large installations where many units are needed. Across the range, ISSS314 drives reach 560MB/s read and 520MB/s write.
Super Talent Technology, a leading manufacturer of NAND Flash storage solutions and DRAM memory modules, unveils its new TwoDrive with Lightning and USB3.0 connectors. Super Talent’s TwoDrive is a high-speed flash drive with Lightning and USB 3.0 dual end connectors to quickly and easily transfer files between devices, and works with use of free STT Mobile Manager app from App Store. The TwoDrive flash drive features a rotational connector design to allow user to swing the Lightning plug while the plug is in use.
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ADATA Technology, a leading manufacturer of high performance DRAM modules, NAND Flash products, and mobile accessories today launched the SE730H external solid state drive, an update of the best-selling SE730. The SE730H performs at 500MB/s read and write, and moves to 3D TLC NAND for increased durability and longevity, while remaining one of the most compact external SSDs worldwide. It has a reversible USB-C connector for greater convenience, and a stylish metallic design. Data transfers use USB 3.1 Gen 2 (up to 10Gbps). Importantly, the SE730H meets IEC IP68 dust and water proof requirements, as well as military-grade shock mitigation standards. Available in 256GB and 512GB, the SE730H is Windows, Mac OS, and Android compatible for seamless cross-platform usage.
Super compact with the benefit of 3D NAND
While previous generation SE730 drives were only available in 250GB, the shift to high quality 3D TLC NAND has allowed ADATA to offer the SE730H in up to 512GB. At the same time, the SE730H maintains is compact footprint as the smallest device in its class (external USB-C 3D NAND SSD). It weighs a mere 33g, and users can choose from gold or red metallic color schemes. With 3D TLC NAND, the SE730H delivers more than just bigger capacity: 3D NAND is also around 25% longer-lasting than 2D NAND, and more reliable for the life of the product while consuming less power, a plus for paired device batteries. In terms of performance, the SE730H reaches 500MB/s read and write, or about five times the speed of external mechanical drives.
QNAP Systems, Inc. today announced the new business-class AMD-powered TS-x73U series NAS; available in 8, 12 and 16-bay models with single and redundant power supply options. With a high-performance AMD Embedded R-Series RX-421ND quad-core CPU (2.1 GHz base, 3.4 GHz boost), a pre-installed dual-port 10GbE SFP+ network card, and two M.2 SATA 6Gb/s SSD slots (for empowering SSD caching to realize optimized storage efficiency with Qtier™ technology), the rack-mountable TS-x73U series is ideal for business organizations looking for a secure private cloud and efficient IT infrastructure for 10GbE networks.
With a dual 10GbE configuration, the TS-x73U series is capable of delivering up to 1,567 MB/s throughput, while the accelerated encryption engine with AES-NI enables unmatched encryption performance of up to 1,244 MB/s to boost system performance. Coupled with high scalability, the 10GbE-ready TS-x73U series satisfies virtualization and fast backup/restoration requirements for an ever-growing amount of data that demands higher bandwidth, and facilitates day-to-day operations with greater productivity.Add a comment
ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, today launched its XPG GAMMIX product series, first shown at Computex 2017. The debut consists of the GAMMIX S10 PCIe3x4 NVMe 1.2 M.2 2280 SSD, capable of 1800MB/s read and 850MB/s write thanks to premium 3D NAND in up to 1TB capacity. The S10 features a stylish heatsink for expedited heat dissipation. It is joined by GAMMIX D10 DDR4 memory modules, which likewise boast a custom heatshield to ensure lower temperatures and more stable performance. They are offed in black and red colors, and in up to 3000MHz factory speeds with a starting speed of 2666MHz on new Intel X299 motherboards. The GAMMIX line provides gamers, PC DIY enthusiasts, and overclockers with additional options that combine performance and design, stemming from the core XPG mission statement of ensuring better experiences.
GAMMIX S10: PCIe3x4 NVMe 1.2 M.2 with a cool twist
With speeds up to 1800MB/s read and 850MB/s write, the S10 leverages the efficiency of the M.2 2280 form factor and the NVMe 1.2 protocol to better serve performance seekers, from gamers to graphics professionals. It cuts down data transfer waits, loading times, and seek latency, and packs up to 1TB 3D TLC NAND driven by an SMI controller. The custom-designed XPG heatsink ensures temperatures are at least 10 degrees Celsius lower than non-shielded M.2 SSDs, promoting stability and longevity. DRAM and SLC caching help maintain peak performance, with read/write IOPS ratings of 130K/140K. The S10 further supports LDPC error correction, and has a 2 million hour mean time before failure rating. It arrives backed by a 5-year warranty. In addition to 1TB, customers can choose from 128GB, 256GB, and 512GB models.
Toshiba Memory Corporation, the world leader in memory solutions, today announced development of the world’s first BiCS FLASH™ three-dimensional (3D) flash memory utilizing Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this groundbreaking device will be showcased at the 2017 Flash Memory Summit in Santa Clara, California, United States, from August 7-10.
Devices fabricated with TSV technology have vertical electrodes and vias that pass through silicon dies to provide connections, an architecture that realizes high speed data input and output while reducing power consumption. Real-world performance has been proven previously, with the introduction of Toshiba’s 2D NAND Flash memory.Add a comment