Addressing the needs of a growing landscape of Internet of Things (IoT) and Fast Data applications at the edge, Western Digital Corporation today announced two new NVMe SSDs – Western Digital PC SN720 and Western Digital PC SN520 – powered by a new NVMe storage architecture, scalable for a range of emerging implementations, from IoT and edge computing to mobile computing systems.
The new Western Digital NVMe client architecture and product portfolio will enable manufacturers of IoT devices, computing devices such as thin and light, 2-in-1 and embedded PCs and monitoring systems to enable the capture and transformation of the massive quantities of data in real-time at the edge of smart city, smart home and personal data environments. Cisco GCI estimates that nearly 850 zettabytes (ZB) will be generated by all people, machines and things by 2021. With the advent of high-bandwidth technologies like 5G, augmented reality and facial recognition, new applications can benefit from the exceptional performance, power efficiency and capacity of NVMe and Western Digital 3D NAND to deliver an optimal user experience.Add a comment
Sonnet Technologies today announced that the new 1TB version of its popular Fusion Thunderbolt 3 PCIe Flash Drive is now shipping. A rugged, pocket-size solid-state drive (SSD) storage device with a Thunderbolt 3 interface, the Mac- and Windows-compatible drive is equipped with 1TB of NVMe flash storage and leverages the 40Gb/s bandwidth of Thunderbolt 3 to deliver data transfer speeds up to 2600 MB/s.
The Fusion Thunderbolt 3 PCIe Flash Drive was designed for pro users requiring ultimate performance in a truly portable storage device, unencumbered by the need for an AC power adapter. The storage device connects to any compatible Mac or Windows computer, or at the end of a Thunderbolt 3 device daisy chain, with its 0.5-meter Thunderbolt 3 (40Gbps) cable. Based on the latest PCIe Gen 3 flash memory technology, the Fusion Thunderbolt 3 PCIe Flash Drive is more than five times faster than 6Gb/s SATA SSDs and USB 3 SSD drives.Add a comment
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s largest capacity Serial Attached SCSI (SAS) solid state drive (SSD) – the PM1643 – for use in next-generation enterprise storage systems. Leveraging Samsung's latest V-NAND technology with 64-layer, 3-bit 512-gigabit (Gb) chips, the 30.72 terabyte (TB) drive delivers twice the capacity and performance of the previous 15.36TB high-capacity lineup introduced in March 2016.
This breakthrough was made possible by combining 32 of the new 1TB NAND flash packages, each comprised of 16 stacked layers of 512Gb V-NAND chips. These super-dense 1TB packages allow for approximately 5,700 5-gigabyte (GB), full HD movie files to be stored within a mere 2.5-inch storage device.Add a comment
In 2017, Intel brought to market a wide array of products designed to tackle the world’s growing stockpile of data. Intel CEO Brian Krzanich called data an “unseen driving force behind the next-generation technology revolution,” and Rob Crooke, senior vice president and general manager of the Non-Volatile Memory (NVM) Solutions Group at Intel, recently outlined his vision for how storage and memory technologies can address all that data. In the past year, Intel introduced new Intel® Optane™ technology-based products and will continue to deliver exciting, blazing-fast solutions based on this breakthrough technology, with announcements later this year. Intel also brought industry-leading areal density to storage for consumers and enterprises, driving both capacity and form factor innovation with Intel® 3D NAND storage products.
Intel is reimagining how data is stored for the data center. By driving the creation and adoption of compelling new form factors, like the EDSFF 1U long and 1U short, and delivering advanced materials, including our densest NAND to date with 64-layer TLC Intel 3D NAND, Intel is enabling capacities of 8TB and beyond in an array of form factors that meet the specific performance needs of data centers.Add a comment
Silicon Power (SP), a leader in performance memory solutions, today released the P32A80 and P32A85 PCIe Solid State Drives, a pair of leading high-performance and long-lasting devices in an already robust pool of SSDs.
For the New Creators Starting Out
The highly functional P32A80 and P32A85 are the ideal SSD solutions for high-end systems that are ready for a new level of performance and responsiveness. SP launches its first ever PCIe SSD, with designers in mind looking for large image rendering and intensive graphic editing capabilities, enterprises demanding high speed file transfer, fast boot-ups, and launches, and also musicians needing high volume recording and music library loading performance. Calvin Ho, one of Silicon Power’s Product Managers adds:
“We’re setting ourselves up to be the leading expert in PCIe trends and to deliver the most excellent performance and quality choice for our channel partners and customers who enjoy cutting-edge technology toys.”Add a comment
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.
Following the memory breakthrough of the automotive industry’s first 128GB eUFS in September, 2017, Samsung’s automotive 256GB eUFS is now being shipped to automotive manufacturers preparing the market for Advanced Driver Assistance Systems (ADAS), next-generation infotainment systems and new-age dashboards in luxury vehicles.Add a comment
ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launches the ISMS331, an industrial SATA 7-pin Disk-On-Module (DOM), which is suitable for desktops, compact computers, industrial computers and embedded applications by providing various specifications and wide temperature support. It also features several key technologies, including self-diagnostics, life time monitoring and ECC (Error Correcting Code) for product longevity and high reliability.
Various Upgrade Configurations for More Possibilities
The ADATA ISMS331 SATA 7-pin DOM utilizes high-quality SLC and MLC NAND flash and comes with a variety of capacities from 4GB to 32GB (SLC models) and 8GB to 128GB (MLC models). It is available in both horizontal and vertical pin orientations to accommodate a wide variety of system form factors. In addition, it provides excellent performance and reliability with sequential read/write speeds of up to 260MB/s for SLC models and 300/180MB/s for MLC models. Thanks to the industrial grade operable temperature range of -40°C to +90°C, the ISMS331 can operate in harsh environments for long periods of time.
SK Hynix Inc. today announced that the Company recently completed developing an enterprise SATA Solid State Drive (or 'eSSD'). With its 72-Layer 512Gb (Gigabits) 3D NAND Flash chips, the Company is paving the way for its full-fledged entrance to the high value-added eSSD market.
SK Hynix combined the 72-Layer 512Gb 3D NAND Flash with its in-house firmware and controller to provide the maximum density of 4TB (Terabytes). SK Hynix makes the most of its 72-Layer 512Gb 3D NAND chips to double the biggest density of the SSD of the same size with 256Gb NAND chips.Add a comment
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has launched an 800-gigabyte (GB) solid state storage drive—the SZ985 Z-SSD, for the most advanced enterprise applications including supercomputing for AI analysis.
Developed in 2017, the new 800GB Z-SSD provides the most efficient storage solution for high-speed cache data and log data processing, as well as other enterprise storage applications that are being designed to meet rapidly growing demand within the AI, big data and IoT markets.Add a comment
ATP Electronics, a leading manufacturer of high-performance industrial memory and storage solutions, spearheads the implementation of industrial temperature (iTemp) support on its latest NVMe M.2 solid state drive modules. The new SSD modules support a wide operating temperature range of -40°C to 85°C to capably address the power and heat issues common in fanless embedded systems as well as extreme temperature variations in Industrial Internet of Things (IIoT) applications, enabling them to perform reliably in harsh environments.
When operating at high speeds in high-throughput scenarios, onboard thermal sensors can detect abnormal temperature elevation and automatically enable a mechanism that adjusts performance to cool the system. According to Peter Huang, ATP Head of Embedded Solid State Drive Business Unit, “ATP Dynamic Thermal Throttling intelligently regulates speed and power to reduce heat without aggressive declines in performance, unlike other thermal solutions that cause abrupt drops and thus compromise stability.” Additionally, the low typical power consumption of 3.3V makes ATP's NVMe M.2 SSDs energy efficient, translating to longer drive usage and cost savings.
ATP's iTemp NVMe M.2 2280 SSD modules take advantage of the PCIe® Generation 3.0 x4 lane high-speed interface, delivering a bandwidth of up to 32 Gb/s (8 Gb/s per lane), which is four to six times the data transfer speed of previous-generation AHCI protocol on Serial ATA drives. Up to three times lower latency, sequential read-write speeds of up to 2,540/1,100 MB/s and random read IOPS (input/output per second) of 100,000, ensure fast and dependable performance to meet the data-intensive needs of industrial and mission-critical applications such as surveillance, medical imaging, and many network storage systems with fast caching requirements.Add a comment