Toshiba Memory Corporation (hereinafter Toshiba) today launched the XG5 series, a new line of NVM Express (NVMe) SSDs integrating 64-layer, 3D flash memories, with a maximum capacity of 1024GB in a thin single-sided form factor. Sample shipments to OEM customers start today in limited quantities, and Toshiba will gradually increase shipments from the third calendar quarter of this year.
The new SSDs, equipped with Toshiba’s latest 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH, utilize the features of PCI EXPRESS® (PCIe®) Gen3 x 4 lanes and SLC cache to deliver 3000 MB/s sequential read and 2100 MB/s sequential write. They are also more efficient than Toshiba existing products and reduce standby mode power consumption by over 50%, to less than 3mW.Add a comment
Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., the independent world leader in memory products, today announced KC1000 NVMe PCIe SSD. Shipping in mid-June, the M.2 NVMe PCIe SSD is over 2x faster than SATA-based SSDs and over 40x faster than a 7200RPM hard-disk drive. KC1000 is built for the power user, providing the ultimate, low-latency performance boost for resource-demanding applications including high-resolution video editing, data visualization, gaming and other data intensive workload environments where traditional storage solutions are unable to keep pace with data demand.
“The demands of today’s performance power users are constantly being put to the test as new data-intensive applications push the boundaries of what can be achieved with even the market’s high performance professional workstations and most powerful gaming rigs,” said Ariel Perez, SSD business manager, Kingston. “KC1000 is the perfect solution to meet the needs of media and design professionals, gaming enthusiasts and anyone who needs ultra-low latency storage performance to end data bottlenecks. This native NVMe device offers one of the industry’s most powerful storage solutions for high-resolution content delivery, virtual reality applications, accelerated game play or a competitive edge for the creative professional on tight deadlines.”Add a comment
Transcend Information, a worldwide leader in storage, multimedia, and industrial products, announced that it will be exhibiting at COMPUTEX TAIPEI 2017 from May 30 to June 3 at the Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan. This year, Transcend will highlight five main categories-high speed PCIe and 3D NAND solid-state drives, dashcams and body cameras, Apple upgrade solutions, personal cloud storage devices, and a broad portfolio of embedded storage solutions, and will offer on-site demonstrations at booth I0808.
3D NAND and PCIe SSDs
This year, Transcend will showcase its complete line up of 3D NAND solid-state drives, including 2.5-inch, M.2, and embedded-use SSDs, all of which feature excellent performance, transfer rates, and reliability. Transcend's latest MTE850 PCIe Gen 3 x4 NVMe M.2 SSD, crafted with 3D MLC NAND flash, will also be on display. Thanks to 3D NAND technology and the next-generation PCIe NVMe protocol, the MTE850 SSD achieves never-before-seen transfer speeds and unquestionable reliability, making it perfect for both gaming and enterprise use.
ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, today launched industrial-grade ISSS333 solid state drives in 3D MLC and 3D TLC versions. The ISSS333 range offers robust temperature, vibration, and shock tolerance as required in commercial and industrial applications. At the same time, users tap fast performance via universally-compatible SATA 6Gbps in a standard 2.5” form factor. Compared to mechanical storage, ISSS333 drives deliver vastly increased reliability, speed, and power efficiency.
More options for a growing audience
While SSDs become more popular as industrial and commercial storage, demand diversifies. Consequently, ADATA offers the ISSS333 range in 3D MLC and 3D TLC (multi-level cell and triple-level cell) versions. The use of 3D NAND ensures improved reliability and efficiency compared to older 2D NAND, with the MLC models ranging in capacity from 120GB to 1TB while TLC ISSS333 drives ship in 128GB to 1TB.
Western Digital Corp., a global data storage technology and solutions leader, today announced the HGST-branded Ultrastar SS300, the company’s highest-performing SAS SSD to date. It is the latest addition to the company’s family of Ultrastar 12Gb/s SAS SSDs, which are used to meet the rigorous data demands of many of the world’s largest companies today. Developed in partnership with Intel, the new Ultrastar SS300 delivers best-in-class random performance, offering speeds of up to 400,000 IOPS random read and up to 200,000 IOPS random write.
“Today, we raise the bar with our newest 12Gb/s SAS SSD, the Ultrastar SS300,” said Ulrich Hansen, vice president of SSD product marketing at Western Digital Corporation. “Built with high-endurance 3D NAND flash memory, the Ultrastar SS300 offers best-in-class speed, outstanding capacity and intelligent power options that enable customers to tailor storage systems and server solutions that are just right for their demanding needs. These benefits are delivered with the same tremendous reliability that has helped to make Ultrastar 12Gb/s SAS SSDs popular around the globe.”Add a comment
Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, will debut its demonstration of the new 64-layer BiCS FLASH 3D technology on an XG Series client Non-Volatile Memory Express (NVMe) Peripheral Component Interconnect Express (PCIe) SSD at Dell EMC World 2017, taking place May 8-11 in Las Vegas. Toshiba’s latest BiCS FLASH delivers a mature combination of performance, cost and endurance for all SSD types.
BiCS FLASH is a three-dimensional (3D) flash memory stacked cell structure suitable for applications that require high capacity and performance, such as enterprise and consumer SSDs. The 512 gigabit (GB) (64 gigabyte), 64-layer device with 3-bit-per-cell (TLC) technology was recently added to Toshiba’s BiCS FLASH memory product line. The new BiCS FLASH is based on the third generation 64-layer stacking process featuring 65 percent greater bit density per mm2 than the company’s 48-layer, 256GB (32 gigabyte) device. The new XG Series SSD is an ideal platform to launch the 64-layer flash memory, due to the product’s broad adoption, maturity and robustness, honed over multiple generations of PCIe/NVMe client SSD product releases.Add a comment
Transcend Information Inc., a leading manufacturer of storage and multimedia products, is proud to introduce the SSD430, an industrial-grade solid-state drive. Compatible with SATA III 6Gb/s specifications, the SSD430 delivers impressive transfer speeds of up to 560MB/s read and 490MB/s write. In addition to blazing speed, Transcend’s SSD430 features excellent reliability and comes in a small, stylish case. The drive is loaded with low-density parity check (LDPC) error-correction code (ECC) and advanced protective technologies, making it an excellent choice for industrial needs.
Top-quality 3D MLC NAND chips translate into greater transfer efficiency
The industrial-grade SSD430 solid-state drive is constructed of 3D MLC NAND flash chips. 3D engineering has increased SSD430’s speeds to an incredible sequential 560MB/s read and 490MB/s write; the random transfer efficiency is also boosted to 310MB/s read and 350MB/s write. Low power consumption and high reliability are also hallmarks of 3D NAND. Transcend’s SSD430 is manufactured for a long-term, stable operation for various types of data and application, and is suited for industrial PCs, automated machinery, and fanless industrial systems.
Micron Technology, Inc. today introduced the Micron SolidScale architecture, an integrated platform that delivers breakthrough low-latency and high performance access to compute and storage. The Micron SolidScale architecture provides customers with the agility to deploy next-generation, cloud-native applications while supporting legacy applications that run the enterprises of today — and tomorrow. From online transaction processing, to virtual platforms and analytics, to machine learning, Micron's innovative architecture not only delivers data quickly due to its extremely high throughput, but it delivers faster time to results because of its unprecedented low latency.
"We estimate that companies using NVMe SSDs deployed in application servers today are on average using less than 50% of their IOPS and capacity. With the new Micron SolidScale architecture, capacity is shared across application servers, unlocking capacity customers have already paid for so that they can do more with less and unleash flash's true performance," said Darren Thomas, vice president, Storage Business Unit, Micron Technology, Inc. "At Micron, we consider the impact of every workload, application and environment as we design the technology, products and systems that allow our customers to deploy applications faster and scale without limits."Add a comment
Today, Intel announced two new Intel 3D NAND solid state drives for data centers, the Intel SSD DC P4500 Series and Intel SSD DC P4600 Series, along with reinforcing its commitment to expanding 3D NAND supply.
The latest additions to the Intel SSD Family for Data Center have been designed from the ground up for cloud storage solutions, including software defined storage and converged infrastructure. The Intel SSD DC P4500 Series, optimized for reads, enables data centers to get more value out of servers and store more data. Designed for mixed workloads, the Intel SSD DC P4600 Series accelerates caching and enables more workloads per server.Add a comment
SP/Silicon Power, a leading provider of memory storage solutions, unveils its latest addition to its dual USB flash drive portfolio – the Mobile C31. The C31 features dual-interface design with USB Type-A and Type-C connectors that enables hassle-free data transmission between “traditional” USB laptops or PCs and new-generation Type-C devices. It also lets users instantly free up to 128GB valuable storage on any Type-C ready smartphone or tablet. For data sharing and storage expansion with ease and style instead of cables or network constraints.
The drive’s 360° swivel cap never gets lost and always protects the end that is not in use. And it is made with a classy diamond cut pattern that adds a lot of style to the swivel. The COB (Chip on Board) technology keeps the C31 tiny and compact as well as protected against water, vibration, and dust. Like a diamond it is made to last and comes with lifetime warranty.Add a comment