Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced that its XS700 Series of portable solid state drives (SSDs) is now available. A small, sleek, stylish, ruggedized, external SSD, the XS700 brings the portable performance that today’s digital lifestyles demand – backed by the technical expertise of the company that invented NAND FLASH memory.
Working with large media files such as 4K video and high-resolution images typically requires more speed than a portable hard drive can provide. The XS700 is a faster, more durable alternative – reaching speeds of up to 4.5 times faster than traditional spinning disk storage. Built with Toshiba Memory Corporation’s in-house 3D flash memory, 64-layer BiCS FLASH™, the XS700 is state-of-the-art portable storage for content creators, photographers and other consumers seeking maximum performance, excellent reliability and quick access to their data on the go.Add a comment
Kingston Digital, Inc., the Flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced its DCP1000 and forthcoming DCU1000 PCIe NVMe solid-state solutions are helping drive needed efficiencies, increased productivity and reducing time-to-market for 4K+ episodic television, feature films, boutique commercial companies, virtual production applications and more. Recently deployed in a studio production environment, Kingston PCIe NVMe gave production, postproduction and media and entertainment (M&E) professionals the ability to work in 4K-to-8K capture workloads in real time, with 8x sustained IO improvements in media review and ingest; 6X reductions in lab ingestion to SAN, and an overall reduction in on-set idle time via maximum throughput to VFX, HDR or postproduction. Kingston will demonstrate the supercharged data performance of its powerful DCP1000 and DCU1000 solid-state products at the 2018 Cine Gear Expo this week (booth B101) at The Studios at Paramount.
“With modern content creators capturing across multiple formats such as Dolby Vision™, digital 65mm, VistaVision, and VRX Arrays, an urgency for a connection-proofed, high-performance solution is paramount,” said Dane Brehm, ICG DIT and Production Technologist. “Deploying both the Kingston DCP1000 and DCU1000 PCIe NVMe SSDs allowed our production to significantly increase on set-to-lab productivity of our original 6K camera RAW files to the lab for color processing, QC, LTO archive and upload. Kingston’s ultra-fast PCIe NVMe SSD storage solutions are designed for extreme data performance for mission-critical and performance-demanding ultra high-resolution raw media and VFX workloads. Both DCP1000 and DCU1000 are helping drive needed efficiencies in the virtual production space, increasing productivity and reducing time to market for high-quality multimedia content with significant creative and technical improvements for modern productions."Add a comment
ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today launched a new addition to its range of portable storage devices, the ADATA UV240 USB Flash drive. It features a convenient flip cap with a quick-slide mechanism to offer effortless cap removal while also doing away with the potential for misplacing the cap. The UV240 works in USB 2.0, comes in white/blue, black and red, and features capacities ranging from 8GB to 64GB.
No More Misplaced Caps with Flip-Cap Design
Sporting a flip-cap design with a quick-slide mechanism, the UV240 has one less part to potentially misplace. The flip-cap design not only prevents users from losing the cap, it also allows it to be easily opened with a flick of a thumb. This simple yet intuitive design helps make the UV240 very satisfying to use on the go.
Lanyard Hole for Easy Carrying and Adding Personal Flair
Like most ADATA USB Flash drives, the UV240 has a lanyard hole for securing it to a lanyard, strap, keychain or other attachments for easy carrying and adding personal flair. This feature further boosts the UV240’s portability and reduces the chances of it being misplaced.
Toshiba Memory Corporation (TMC) today announced that it decided to start construction of a new state-of-the-art fab for BiCS FLASH, its proprietary 3D flash memory, in Kitakami, Iwate prefecture in July this year.
TMC has selected Kitakami City as the next location to expand its operations in September last year, and has started preparations for construction of the new fab. Demand for 3D flash memory is increasing significantly on fast growing demand for enterprise SSD for datacenters and servers. TMC expects continued strong growth in the mid and long term, and the timing of its construction positions it to capture this growth and expand its business.
The new fab will be completed in 2019, and will have a quake absorbing structure and an environmentally friendly design that includes the latest energy saving manufacturing equipment. It will also introduce an advanced production system that uses artificial intelligence (AI) to boost productivity. Decisions on the new fab’s equipment investment, production capacity and production plan will reflect market trends. TMC expects to continue its joint venture investments based on discussion with Western Digital in the new facility.Add a comment
Micron Technology, Inc. and Intel Corporation today announced production and shipment of the industry's first 4bits/cell 3D NAND technology. Leveraging a proven 64-layer structure, the new 4bits/cell NAND technology achieves 1 terabit (Tb) density per die, the world's highest-density flash memory.
The companies also announced development progress on the third-generation 96-tier 3D NAND structure, providing a 50 percent increase in layers. These advancements in the cell structure continue the companies' leadership in producing the world's highest Gb/mm2 areal density.
Both NAND technology advancements—the 64-layer QLC and 96-layer TLC technologies —utilize CMOS under the array (CuA) technology to reduce die sizes and deliver improved performance when compared to competitive approaches. By leveraging four planes vs the competitors' two planes, the new Intel and Micron NAND flash memory can write and read more cells in parallel, which delivers faster throughput and higher bandwidth at the system level.
The new 64-layer 4bits/cell NAND technology enables denser storage in a smaller space, bringing significant cost savings for read-intensive cloud workloads. It is also well-suited for consumer and client computing applications, providing cost-optimized storage solutions.Add a comment
Micron Technology, Inc. has commenced shipments of the industry's first SSD built on revolutionary quad-level cell (QLC) NAND technology. Unveiled at Micron's 2018 Analyst and Investor Event, the Micron 5210 ION SSD provides 33 percent more bit density than triple-level cell (TLC) NAND, addressing segments previously serviced with hard disk drives (HDDs). The introduction of new QLC-based SSDs positions Micron as a leader in providing higher capacity at lower costs to address the read-intensive yet performance-sensitive cloud storage needs of AI, big data, business intelligence, content delivery and database systems.
As workloads evolve to meet the ever-increasing demands for real-time data insights and analytics, data centers increasingly need the capacity, speed, reliability and steady state performance that enterprise flash storage provides. Micron QLC NAND — reaching densities of 1 terabit with its next-generation 64-layer 3D NAND structure — is optimized to meet these demands and make SATA SSD performance and capacity more approachable than ever before.Add a comment
ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND flash products, today launched the industrial-grade ADATA IM2P33F8 PCIe Gen3x4 and IM2S3168 SATA 6Gbps M.2 2280 solid state drives. Both drives employ durable and long-lasting 3D NAND flash for extended longevity and improved power efficiency compared to 2D NAND, and are ideal upgrade options for a wide range of systems and installations.
IM2P33F8 PCIe Gen3x4 – An Excellent Alternative to SATA SSDs
With a price tag comparable to SATA SSDs, the IM2P33F8 is an excellent alternative for upgrading a range of systems and installations, from laptops to surveillance systems. Utilizing 3D NAND flash it provides read/write performance of up to 2050/1600MB per second, as well as amazing reliability, durability, and stability. It supports Host Memory Buffer (HMB) technology, enabling it to enhance random read/write performance. For upholding data integrity and safety, the IM2P33F8 supports End-to-End (E2E) Data Protection to keep data consistent along the entire data transfer path, while support for RAID Engine reduces the risk of data loss due to drive failure. IM2P33F8 is available in capacities ranging from 128GB to 512GB, and features a slim single-sided design for high compatibility.
GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, presents its UD PRO series SATA Interface SSDs with built-in DDR3 RAM, adhering to GIGABYTE standards for high quality, ultra durable products and providing users with a superior product experience.
Newly introduced GIGABYTE UD PRO series SSDs include both 256GB and 512GB capacity options and come with a clean, sleek design featuring a black and gray exterior with the product name engraved in white. Not only they do utilize high quality 3D NAND Flash memory, they also come with a high-speed, low power DDR3L buffer cache to accelerate the read/write speeds of the SSD, fulfilling the GIGABYTE standard for high quality products.Add a comment
TDK Corporation announces the sequential launch of the embedded SD ESRD4 series, the embedded SSD ESS1B series and the M.2 SSD Type 2280-D5-B-M SNS1B series.
With the progress of IoT, the demand for micro storage for edge data is rapidly expanding. In particular, eMMC, which can be mounted on a surface, was expected to be potent, but the trend is shifting from eMMC to UFS, which is associated with the larger capacity of smartphones.
On the other hand, a reliable and appropriate storage capacity is required for I-IoT that usually uses a small capacity.
TDK’s embedded SD ESRD4 series is a SD card, equipped with a highly durable SLC/pSLC NAND flash that can be implemented on boards. It covers a wide range of capacities from 1GB to 32GB, suitable for storing a lightweight system such as Linux and RTOS.Add a comment
SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products, today announced that it has begun shipping its nvNITRO Accelerator Card featuring MRAM technology. SMART has partnered with Everspin Technologies, Inc., the world's leading developer and manufacturer of discrete and embedded magnetoresistive random access memory (MRAM), to launch the new Spin-transfer Torque MRAM (STT-MRAM)-based nvNITRO Accelerator Card. The nvNITRO is ideally suited for the most demanding transaction logging applications and, along with enhanced performance features, is designed with plug-and-play capability requiring no changes to system hardware, memory reference, bios or file systems.
MRAM technology is byte-addressable and persistent with very low latency, enabling dramatically improved system performance for many applications. The nvNITRO Accelerator Card fully exploits these unique attributes to provide a disruptive solution for industries where transaction processing and data recording performance are critical. For example, nvNITRO can reduce financial application wait times by reducing latency up to 90% over enterprise SSDs. Based on this performance data, SMART and Everspin will jointly target customers in the financial sector including joint demonstrations of nvNITRO performance at The Trading Show in Chicago, May 9-10.Add a comment