ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today launched its ADATA Ultimate SU750 2.5” SATA 6Gb/s solid-state drives (SSD). With next-generation TLC (Triple-Level Cell) 3D NAND Flash and a host of other features, SU750 SSDs deliver terrific value, great performance, and superb reliability to offer users an excellent option for their next upgrade.

adata su750 ssd

Implementing 3D NAND Flash, Ultimate SU750 SSDs features higher storage capacities of 256GB, 512GB, and 1TB. With SLC Caching, the drives can achieve read/write speeds of up to 550/520MB per second to accelerate PC performance. Users will revel in not having to wait around to access files and for programs to load. What’s more, with no mechanical components, SU750 SSDs are more resilient than HDDs. They are more resistant to shock and vibration (1500G/0.5ms), therefore providing better protection of data. Also, SSDs also run silently and consume less power than HDDs.

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Toshiba Memory Corporation, the world leader in memory solutions, today announced the development of a bridge chip that realizes high-speed and large-capacity SSDs. Using developed bridge chips with a small occupied area and low-power consumption, the company has succeeded in connecting more flash memory chips with fewer high-speed signal lines than with the conventional method of no bridge chips. This result was announced in San Francisco on February 20, at the International Solid-State Circuits Conference 2019 (ISSCC 2019).

toshiba bridge chip

In SSDs, multiple flash memory chips are connected to a controller that manages their operation. As more flash memory chips are connected to a controller interface, operating speed degrades, so there are limits to the number of chips that can be connected. In order to increase capacity, it is necessary to increase the number of interfaces, but that results in an enormous number of high-speed signal lines connected to the controller, making it more difficult to implement the wiring on the SSD board.

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smart n200 ssdSMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products, today announced the introduction of its N200 line of SATA products. With burst speed and low power consumption, the N200 family is an ideal economic option for NAS/SAN storage systems, x86 server-storage appliances, distributed scale-out servers, telecom and networking routers and switches, industrial control, printers and more.

Built with Triple Level Cell (TLC) 3D NAND technology, the new N200 line of SATA products, consisting of the mSATA (MO-300), the M.2 2242 and 2280, the Slim SATA (MO-297), and the removable 2.5" solid state drive form factors, delivers the advantages of economical, industrial-grade non-volatile memory to embedded computing applications. The N200 SATA products are offered in capacities ranging from 32GB to 1TB, depending on form factor, and all are available in industrial and commercial temperatures.

N200 products offer excellent burst read/write performance, suitable for applications that require lower drive capacity and utilize the drive for boot up code and operating system (OS) code storage. The higher capacity drives are an excellent choice for transaction intensive applications such as x86 server-storage appliances, telecommunications and networking routers and switches, Advanced Telecommunications Computing Architecture (ATCA) computer blades, single board computers for defense, gaming, industrial control applications and printers.

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Plugable, the leading developer of USB, Thunderbolt, Bluetooth and power-related devices, launches the 10Gb USB-C (USB 3.1 Gen 2) NVMe SSD Enclosure, the first high performance NVMe enclosure to feature a completely tool-free, spring-loaded design for inserting and removing a compatible SSD, along with advanced thermal management to maximize performance and device lifespan.

plugable nvme enclosure

With a sleek and slim profile, a rugged aluminum body for improved heat dissipation, and USB Type-A and Type-C host compatibility, the Plugable USB-C NVMe Enclosure is an optimal solution for safeguarding SSDs when moving from the workplace to the home office and achieving maximum transfer performance speeds on PCs, Macs and Linux devices.

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samsung 512gb evo plus microsdxcToday people share their lives through pictures and video taken on their smartphones and cameras, whether that’s incredible moments from a vacation or brief moments of their daily lives. Devices have quickly evolved to allow anyone to become a content creator, capturing and sharing high-resolution and 4K content easily.

Since content is easier than ever to capture, people need the right storage options to help meet their needs, that’s why Samsung is introducing the Samsung 512GB microSDXC EVO Plus. The new memory card delivers more storage in a tiny package, to easily give people the freedom to save more content on their smartphones, cameras, tablets, drones, and more.

The Samsung 512GB microSDXC EVO Plus is equipped with a full-size SD card adapter for multi-device flexibility. Pairing the card with the Samsung Galaxy Note9 creates the optimal solution for today’s content creators, who can now bolster their phone’s storage capacity to 1TB.

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Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first one-terabyte (TB) embedded Universal Flash Storage (eUFS) 2.1, for use in next-generation mobile applications. Just four years after introducing the first UFS solution, the 128-gigabyte (GB) eUFS, Samsung has passed the much-anticipated terabyte threshold in smartphone storage. Smartphone enthusiasts will soon be able to enjoy storage capacity comparable to a premium notebook PC, without having to pair their phones with additional memory cards.

samsung eUFS 1TB

“The 1TB eUFS is expected to play a critical role in bringing a more notebook-like user experience to the next generation of mobile devices,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “What’s more, Samsung is committed to assuring the most reliable supply chain and adequate production quantities to support the timely launches of upcoming flagship smartphones in accelerating growth of the global mobile market.”

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OWC, a leading zero emissions Mac and PC technology company, has released the second generation of their super-fast ThunderBlade external SSD, with a lower price point and improved performance. For creative professionals and prosumers who work to capture and process 4K or 8K video, the updated ThunderBlade Gen 2 can be the difference between staying under budget and on-schedule on a project - or not.

owc ThunderBlade external SSD

The new ThunderBlade is stackable and runs cooler than the previous iteration, while still maintaining a near-silent environment with its fanless operation, all factors that can be critical in an operation on the go or in a tight space. With dual Thunderbolt 3 ports users can daisy-chain up to five additional ThunderBlades, and by connecting more than one drive with SoftRAID, speeds can be increased up to 3800MB/s. The newest ThunderBlade can complete a 1TB content transfer in under four-and-a-half minutes.

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Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, has started sampling the industry’s first Universal Flash Storage (UFS) Ver. 3.0 embedded flash memory devices. The new lineup utilizes the company’s cutting-edge 96-layer BiCS FLASH™ 3D flash memory and is available in three capacities: 128 gigabytes, 256GB and 512GB. With high-speed read/write performance and low power consumption, the new devices are ideal for applications such as mobile devices, smartphones, tablets, and augmented/virtual reality systems.

toshiba ufs ver3 embedded flash

Consumers continue to demand increasingly higher performance and an improved user experience from their devices, and the UFS standard is constantly being refined in order to support this evolution. With the introduction of UFS 3.0, JEDEC, the global leader in the development of standards for the microelectronics industry, has enhanced previous versions of the UFS standard to help product designers enable significant improvements in mobile devices and related applications.

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Samsung Electronics America, today introduced the Samsung 970 EVO Plus, the newest enhancement in its Non-Volatile Memory Express (NVMe) SSD portfolio. With industry-leading performance and up to two terabytes in capacity, Samsung’s 970 EVO Plus sets a new bar for high-performance storage, enabling IT professionals, tech enthusiasts and gamers to handle intensive workloads on PCs and workstations with more ease.

Samsung 970 evo plus ssd

“Since introducing the first NVMe SSDs to the consumer market in 2015, Samsung has continued to challenge technical barriers in SSD design and performance,” said Dr. Mike Mang, vice president of Brand Product Marketing, Memory Business at Samsung Electronics. “The new 970 EVO Plus powered by Samsung’s latest fifth-generation V-NAND technology will now offer unrivaled performance in its class when taking on demanding tasks like 4K content editing, 3D modeling and simulation as well as heavy gaming.”

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Today Starblaze announced the availability of the STAR1000P NVMe solid state drive (SSD) controller for high-end client and entry-level enterprise applications. Performance optimizations enable the new controller to achieve sequential reads at 3.6GB/second and sequential writes at 3.2GB/second, up to 50% higher than Starblaze's previous generation controller, STAR1000. The STAR1000P achieves random reads at 750K input/output operations per second (IOPS) and random writes at 600K IOPS, up to 120% higher than Starblaze's STAR1000. The STAR1000P features PCIe Gen3x4, NVMe 1.3 and eight flash channels to support up to 32 terabytes (TB) of storage. The STAR1000P also incorporates a multicore implementation of Synopsys' DesignWare® ARC® HS38 processor, taking advantage of ARC's extensible architecture with custom instructions that improve scheduling efficiency.

"Enterprise SSD applications need increasing processor performance to support much higher throughput with reduced latency," said John Koeter, vice president of marketing for IP at Synopsys. "Synopsys' ARC HS processors deliver the scalability that Starblaze needs to extend the performance of their STAR1000P platform for the rapidly evolving SSD controller market."

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