Crucial, a leading global brand of memory and storage upgrades, announced today the availability of the Crucial BX500 SSD, a next-generation drive designed to provide everyday computing users with a fast and reliable storage upgrade. Available in a 2.5-inch form factor and 120GB, 240GB, and 480GB capacities, the BX500 is the easiest way to get all the speed of a new computer without the price.
With sequential read/write speeds up to 540/500 MB/s, the new BX500 enables faster system boot up, faster file loads, and overall improved system responsiveness. The BX500 has no moving parts, making it a cooler, quieter, and more reliable alternative to a hard drive. Furthermore, because it uses less power than a hard drive, laptop battery life is extended.
Samsung Electronics America, Inc. today unveiled the Samsung Data Center solid-state drive (SSD) lineup to address current and future trends in high performance computing storage in the big data era for small and medium businesses (SMBs). Samsung’s new family of Data Center SSD solutions, which consists of the 860 DCT, 883 DCT, 983 DCT and the 983 ZET, are engineered to meet the evolving needs of SMBs, including faster, sustained performance, higher capacities and enterprise-class reliability and security.
Samsung’s Data Center SSD portfolio will raise the bar for efficiency compared to legacy storage systems, requiring fewer servers and reduced power and cooling for a lower total cost of ownership (TCO). The new lineup delivers better Quality of Service (QoS) for SMBs by reducing latency and lowering data delays. The entire line provides enhanced reliability and endurance for 24/7 operation backed by a 5-year limited warranty and impressive Drive Writes Per Day (DWPD) ratings.Add a comment
Sony today announced a brand new innovation in storage media with the launch of the “SF-G series TOUGH specification” UHS-II SD card. Addressing the needs of photographers who are reliant upon their photographs remaining safe when their SD cards are removed from the camera, the new SF-G series TOUGH specification range combines the world’s fastest read and write speeds with an ultra-rugged design that is bend proof to 180N, and drop proof to 5 metres. For photographers who are fighting against the elements to get the perfect shot, the SF-G series TOUGH specification range of SD cards are also waterproof with an IPX8 rating and dustproof with an IP6X rating.
The new SF-G series TOUGH specification range of SD cards are 18 times stronger than the SD standard with world’s first monolithic structure (one-piece molding, no empty space in the card) and materials of high-grade hardness, unlike conventional SD cards with a thin, 3-part ensemble. They areprotected against typical physical damage that can affect conventional SD cards such as a broken plastic casing, broken data protection lock and broken connector ribs. This has been achieved through a new means that it is the world’s first rib-less SD card with no write protection switch. These developments ensure that the SF-G series TOUGH specification is more resistant to bending and easy to break parts are removed entirely and has been engineered by Sony to deliver the best balance of hardness and toughness. Completely sealed with one-piece molding structure, no waterdrop, dust or dirt is not allowed to come into the card, meeting highest grade of waterproof (IPX8) and dustproof (IP6X).Add a comment
New consumer electronics products continue expansion of Silicon Power’s diverse line following the success of several key products including memory modules, headphones, and portable SSDs. SP, a leader in memory storage solutions, is introducing four PCIe SSDs to customers to top off an exciting summer for technology and electronic companies.
Superior Storage Performance for Performance Gaming, Modification, and Upgrades
As the company recently expanded and innovated its product line, it returns to its area of expertise by releasing the P34A80/PCle Gen3x4 & NVMe 1.2, the P34M85/PCle Gen3x4 & NVMe 1.2 with an added heat sink, and upgrades to the P32A80/PCle Gen3x2 & NVMe 1.2 and P32M85/PCle Gen3x4 & NVMe 1.2 with added heat sink.
Samsung Electronics Co., Ltd., today unveiled its first NVMe-based portable solid state drive (SSD) – the Samsung Portable SSD X5 – achieving new levels of performance and reliability for external storage solutions. Based on the cutting-edge Thunderbolt 3 technology, the new X5 features exceptional speeds in a compact and durable form factor, making it an ideal portable storage for content creators and IT professionals on the go.
“As a leader in high-performance and reliable storage solutions, we are thrilled to continue to advance the external SSD market with the introduction of our first Thunderbolt 3 portable SSD,” said Dr. Mike Mang, vice president of Brand Product Marketing, Memory Business at Samsung Electronics. “The X5 is yet another testament to Samsung’s commitment to providing innovative portable storage solutions that enable faster transfer of large data files, saving users’ valuable time.”Add a comment
ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash products, today announces the launch of XPG SX6000 Pro PCIe Gen3x4 M.2 2280 SSDs. With NVMe 1.3 technology and 3D NAND Flash, they sport excellent speeds and up to 1TB of capacity, making them a viable alternative to SATA SSDs. In addition, SX6000 Pro SSDs are slimmer than standard M.2 2280 SSDs for a higher level of compatibility thanks to a single-sided design.
Excellent Upgrade Alternative in Multiple Capacities
ADATA produces the SX6000 Pro in 256GB, 512GB, and 1TB. For PC users looking at tangible performance enhancements, the SX6000 Pro makes complete sense as a SATA successor. The principal advantage of the SX6000 Pro is embodied in its superb cost-performance ratio. Using 3D TLC NAND, NVMe 1.3 technology, and a PCIe Gen3x4 interface, it reaches up to 2100MB/s read and 1500MB/s write and random performance of up to 250K/240K IOPS. This means up to four times the speed of typical SATA SSDs.
Expanding on its Nytro portfolio of enterprise flash products, Seagate today announced the launch of its new Nytro 1000 Series SATA SSD drives.
The Seagate Nytro 1000 SATA SSD series (which includes the Nytro 1351 and Nytro 1551 SSDs) delivers ultra-fast, consistent performance for read-intensive workloads. Globally available in the fall, the Nytro SSDs is being demonstrated at this week’s Flash Memory Summit in Santa Clara.
The Nytro SSD series is designed to serve as the backbone of the enterprise’s cloud infrastructure, making it ideal for data center managers looking to upgrade their existing systems.
Unique DuraWrite technology reduces cumulative amount of data written
Among the innovations behind the Nytro SSD is Seagate DuraWrite technology, a unique lossless data reduction technology which compresses data flowing through Seagate’s internally-developed controller. The NAND flash memory inside SSDs is sensitive to the cumulative amount of data written to it; the more data written to flash, the shorter the SSD’s service life and the sooner its performance will degrade.
Seagate’s DuraWrite technology uses intelligent lossless compression techniques to reduce the amount of data stored on the flash. That enables up to 3.5 times higher random-write performance than competitive offerings, along with greater power efficiency and cost savings.Add a comment
Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers and solid-state storage devices, today released the SM2270, a complete PCIe NVMe SSD controller solution which offers high performance, high capacity, high reliability and low latency SSD storage for enterprise and data center applications.
The dual-mode SM2270 is a complete SSD controller solution with customer specific or turnkey firmware that can support Open Channel storage implementations as well as standard NVMe protocols. In either mode, the SM2270 management technology enables ultra-high performance, guaranteed low latency, and more efficient use of storage capacity in high density, multi-tenant data center applications.
The controller specifications include:
Marvell today announced the industry's first NVMe over Fabric (NVMe-oF) SSD converter controller, the 88SN2400, for cloud and enterprise data centers. The 88SN2400 controller is designed and optimized to convert an NVMe solid state drive (SSD) into an NVMe-oF SSD, providing a revolutionary architecture that increases utilization and scalability of SSDs within the data center to ultimately lower total cost of ownership (TCO). By bringing low latency access over the fabric and exposing the entire SSD bandwidth to the network, the Marvell controller supports true scalable, high-performance disaggregation of storage from compute. The 88SN2400 utilizes a simple, low-power and compute-less Ethernet fabric instead of a traditional PCIe fabric controlled and managed by an enterprise-class server SoC with integrated 100GE controllers.
As data growth continues to soar, data centers are grappling with the increasing power consumption, complexity, and costs associated with the demand for greater storage bandwidth and capacity. However, compute and storage continue to be underutilized, with storage servers typically oversubscribed, resulting in increased capital expenditure and operational expenditure. The Marvell SSD converter controller allows greater flexibility for data center operators and designers to develop their infrastructure and enables them to meet evolving workload demands with optimized scalable units of disaggregated flash storage and storage class memory (SCM).Add a comment
Yangtze Memory Technologies Co., Ltd (YMTC), a new player in the NAND industry, today announced the market introduction of its ground-breaking technology - Xtacking, which will provide unprecedented NAND I/O performance, higher bit density and faster time-to-market.
With Xtacking, the periphery circuits which handle data I/O as well as memory cell operations are processed on a separate wafer using the logic technology node that enables the desired I/O speed and functions. Once the processing of the array wafer is completed, the two wafers are connected electrically through millions of metal VIAs (Vertical Interconnect Accesses) that are formed simultaneously across the whole wafer in one process step, using the innovative Xtacking technology, with limited increase in total cost.Add a comment