Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass production of the industry’s first 512-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution for use in next-generation mobile devices. Utilizing Samsung’s latest 64-layer 512-gigabit (Gb) V-NAND chips, the new 512GB eUFS package provides unparalleled storage capacity and outstanding performance for upcoming flagship smartphones and tablets.
“The new Samsung 512GB eUFS provides the best embedded storage solution for next-generation premium smartphones by overcoming potential limitations in system performance that can occur with the use of micro SD cards,” said Jaesoo Han, executive vice president of Memory Sales & Marketing at Samsung Electronics. “By assuring an early, stable supply of this advanced embedded storage, Samsung is taking a big step forward in contributing to timely launches of next-generation mobile devices by mobile manufacturers around the world.”Add a comment
Western Digital Corp. today introduced a new portfolio of advanced iNAND embedded flash drives (EFDs) to empower smartphone users to unlock the full potential of today’s data-driven applications and experiences. Leveraging Western Digital’s 64-layer 3D NAND technology and advanced UFS and e.MMC interface technologies, the intelligent, new iNAND 8521 and iNAND 7550 EFDs deliver outstanding data performance and high storage capacity. When designed into smartphones and thin, lightweight computing devices, they accelerate the possibilities of a wide range of demanding data-centric applications, including augmented reality (AR), high resolution video capture and rich social media experiences, as well as emerging artificial intelligence (AI) and Internet of Things (IoT) experiences at the “edge.”
The volume, velocity, variety and value of data continues to exponentially grow and evolve across Big Data, Fast Data and personal data. Many consumers around the world will experience this confluence of data on their smartphone.Add a comment
Continuously dedicated to satisfying the needs of our consumers in every respect, Team Group today announced the elegant and rounded C173/C175 Pearl USB drive. With black and white two colors to choose from, they look like mysterious, luxury black pearl and pure, flawless white pearl born from the deep ocean. The streamlined unibody of the Pearl USB drive is designed for easy grab and use, and able to offer users a well-rounded and comfortable hand held feeling.
Being in a mobile digital era, having an easy carry USB drive with solid build quality is a necessary tool whether you are at work or in school. The overall seamless design of Team Group C173/C175 Pearl USB drive is ingenuity and unique. It does not scratch hands or get dirty easily. The well-proportioned, rounded appearance and the ingenious, exquisite design make it look simple, sleek and yet elegant. Moreover, after thoughtfully considering the usage convenience, the C713/175 Pearl USB drive added a hidden latch to the design so consumers can plug cap to the back to avoid cap loss problem. Besides the convenience, the elegant and aesthetic overall design can also be maintained.Add a comment
Toshiba Memory Corporation, the world leader in memory solutions, has enhanced its line-up of client SSDs with the launch of premium models in its XG5-P series. The new NVM Express (NVMe) client SSDs improve on the performance of the current XG5 series models and double the maximum capacity to 2TB. Sample shipments to OEM customers start today in limited quantities, and Toshiba Memory Corporation will gradually increase shipments from the first calendar quarter of 2018.
The XG5-P series also utilizes a PCI Express (PCIe) Gen3 x 4 lane and NVM Express Revision 1.2.1 interface, and delivers performance of up to 3000 MB/s sequential read and 2200 MB/s sequential write, and up to 320,000 IOPS random read and 265,000 IOPS random write. Its random read/write performance in full access range is approximately 55% better than that of standard XG5 series products. At the same time, low power consumption is maintained at less than 60mW during operation.Add a comment
Sony today announced the launch of a range of high performance CFast memory cards designed to meet the needs of professional photographers and videographers. The new G Series CFast responds to the ever increasing capabilities of high-end DSLR and 4K cinema-grade broadcast cameras, offering lightning-fast write speeds of up to 510MB/s and read speeds of up to 530MB/s.
“Joining an established range that includes Professional internal SSDs, XQD and SxS cards, as well as the world’s fastest SD card, the new CFast models strengthen Sony’s position as a leader in professional memory solutions, improving the shooting experience and optimising the workflow.” said Romain Rousseau, Senior European Product Manager.Add a comment
Toshiba Memory Corporation, the world leader in memory solutions, has today started sampling Universal Flash Storage (UFS) devices utilizing Toshiba Memory Corporation’s cutting-edge 64-layer, BiCS FLASH 3D flash memory. The new UFS devices meet performance demands for applications that require high-speed read/write performance and low power consumption, including mobile devices such as smartphones and tablets, and augmented and virtual reality systems.
The new line-up will be available in four capacities: 32GB, 64GB, 128GB and 256GB. All of the devices integrate flash memory and a controller in a single, JEDEC-standard 11.5 x 13mm package. The controller performs error correction, wear leveling, logical-to-physical address translation and bad-block management, allowing users to simplify system development.Add a comment
Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards and high-performance storage solutions, is thrilled to announce the release of a new series of SSD from COLORFUL: the new PLUS Series SSD. Available in capacities up to 640GB, the COLORFUL PLUS Series SSD offers the latest in 3D TLC NAND Flash technology along with a new SMI SM2258XT controller offering a new NAND Flash configuration while still offering competitive endurance, capacity and price.
The COLORFUL Plus Series SSD are expected to ship to distributor by November and will be available in three capacities: 160GB(SL300 Plus 160G), 320GB (SL500 Plus 320G) and 640GB (SL500 Plus 640G).Add a comment
ADATA Technology, a leading manufacturer of high performance DRAM modules and NAND Flash products, today launched the XPG STORM heatsink add-on for M.2 2280 drives. STORM features an aluminum heatsink and with a fan. It can be easily affixed to any compatible SSD to provide powerful cooling. Lower SSD temperatures promote more stable storage and system performance, in addition to the XPG-styled STORM heatsink with its colorful RGB lighting contributing to attractive, gaming-themed PC setups.
Lower temperatures complement high speeds
While M.2 2280 PCIe SSDs are currently the fastest on the market, their high data rates also mean considerable heat buildup. Without a heatsink, accumulating heat can compromise performance and accelerate SSD aging. STORM includes an aluminum heatsink that fits on any M.2 SSD without causing overhead issues. Together with the heatsink, STORM uses a fan to circulate cool air and reduces temperature by at least 25% when compared with bare M.2 SSDs.
Today TDK Corporation announced the gradual launch of SD Memory cards (MMRD4 series) and microSD Memory cards (MURD4 series) from January 2018. Both series support UHS-I for industrial application.
The rapid progression of IoT has increased demand for smaller SD/microSD Memory cards with low power consumption for the storage of sensor information. However, as SD/microSD Memory cards for general use adopt TLC and MLC type flash memory to reduce costs, they are largely unsuitable for industrial application in terms of durability and reliability.
The MMRD4 and MURD4 series consist of highly reliable SD/microSD Memory cards equipped with very durable SLC/pSLC flash memory as well as the newly developed SD controller, TDK GBDriverRD4. In addition to data retention capacity and durability, the cards feature robust data security in the event of power interruption, ensuring safe usage in IoT devices that are often turned off to conserve power.Add a comment
Today, Intel and Micron announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory media, a building block of Intel Optane technology that includes Intel Optane memory for clients, the recently announced Intel Optane SSD 900P Series and new capacities and form factors of the Intel Optane SSD DC P4800X Series. A ribbon-cutting was held at the facility with Utah Gov. Gary Herbert, employees of the facility and representatives from Intel and Micron.
The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint technology, the first entirely new memory media in 25 years. The technology was developed to meet the quickly expanding data needs for all types of customers. 3D XPoint technology uses a crosspoint structure to deliver a cell and array architecture that can switch states significantly faster than NAND.
“Intel Optane technology is changing the way we interact with the incredible amounts of data being created every day, and this expansion will help us meet demand for the extraordinary products we’ve introduced this year and the exciting roadmap ahead,” said Rob Crooke, senior vice president and general manager of the Non-Volatile Memory (NVM) Solutions Group at Intel Corporation. “When we bring data closer to the CPU and enable blisteringly fast access to that data, we can empower customers to create incredible experiences and deliver data results we’ve never had before – faster MRIs, smoother gaming experiences, real time analytics and so much more.”Add a comment